SMT设备原理与应用课件.pptx

1、SMT设备原理与应用Principle and Application of SMT Equipment2010.9 本课程主要讲述内容，时间安排，考试安排，实验，辅导和平时考勤 SMT工艺流程和相关设备SMT设备概述 Summarize SMT概述与发展趋势 4学时 summary and trend 焊膏组成与印刷的方式 4学时 solder paste composition and printing technology 印刷机原理与应用 6学时 principle and application of printer 贴片机原理与设备 12学时 principle and appli

2、cation of placement machines 波峰焊原理与应用 6学时 principle and application of wave soldering oven 再流炉原理与应用 6学时 principle and application of reflow soldering oven 检测设备 4学时 inspection equipment本课程的主要内容Including SMT生产线参观（印刷机、再流炉）2学时 Visiting SMT production line(printer,reflow oven)贴片机编程原理；2学时 Mounter(placemen

3、t machines)program 贴片设计性实验。2学时 Placement process design experiment实验内容 experiment content 期末考试：开卷，占总分60%平时：20%（作业50%+考勤40%+特别贡献10%）实验：20%考试方式 test rules 联系方式：13737744076 ， 辅导时间和地点：地点：时间：每周辅导时间和联系方式SMT概述与发展趋势Summary and Trends Surface mount technology was developed in the 1960s and became widely used

4、 in the late 1980s.Much of the pioneering work in this technology was by IBM.Components were mechanically redesigned to have small metal tabs or end caps that could be to the of the PCB.Components became much smaller and component placement on both sides of a board became far more common with surfac

5、e mounting than through-hole mounting,allowing much higher circuit densities.Surface mounting lends itself well to a high degree of automation,reducing labor cost and greatly increasing production rates.SMDs can be one-quarter to one-tenth the size and weight,and one-half to one-quarter the cost of

6、equivalent through-hole parts.SMT技术发展历史和优点History and benefitsSMp DIALECTExpanded FormChinesSMDSurface Mount Devices(active,passive and electromechanical components)表面贴装器件SMTSurface Mount Technology(assembling and montage technology)表面贴装技术SMASurface Mount Assembly(module assembled with SMT)表面装配SMCSu

7、rface Mount Components(components for SMT)表面贴装组件SMPSurface Mount Packages(SMD case forms)表面贴装元件封装形式SMESurface Mount Equipment(SMT assembling machines)表面贴装设备常用术语TermsChip ResistorMELFMetal Electrode Face resistorschip capacitorchip inductordiscrete semiconductorSOChip CarrierPlastic Leadless Chip Car

8、rierLeadless Ceramic Chip CarrierQuad Flat PackageBall grid arraySOSmall Outline(4 to 28 pins)小外形结构SOPSmall Outline Package(case)小外形封装SODSmall Outline Diode小外形封装分立二极管SOTSmall Outline Transistor小外形封装分立三极管SOICSmall Outline Integrated Circuit小外形集成电路CCChip Carrier芯片载体LCCLeadless Chip Carrier无引线芯片载体PLCCP

9、lastic Leadless Chip Carrier塑封无引线芯片载体LCCCLeadless Ceramic Chip Carrier无引线陶瓷芯片载体MELFMetal Electrode Face Bonding金属电极柱形电阻QFPQuad Flat Package四边引脚扁平封装BGAball grid array球栅阵列封装The solder joint configurations of the IC packages can be represented by five major categoriesGullwing leads 翼型引脚J-lead design J型

10、引脚Butt-leads 对接引脚leadlessBall-lead 球形引脚Types of surface mount assemblytechnology表面组装技术的类型Type I surface mount boards have SMCs for both sides of the boardsType II boards have on one side of the board and chip components on the other sideType III SMT have on one side of the board and chip components

11、on the other sideSurface mount soldering process表面组装焊接类型Wave soldering适用于通孔装配技术THT和通孔元件THC为了减小阴影效应（shadowing effect）,通常采用双波峰技术（dual wave）,前面是湍流波（turbulent wave）用于确保所有的引脚润湿，后面的层流波（laminar wave）用于焊接波峰焊仅适用于小的SMCs，大的SMCs和行间距依然是存在桥接（bridge）和焊锡不足等问题reflow soldering使用预配置好的焊膏（solder paste）进行焊接，焊膏本身可以作为粘接剂焊膏

12、用模版印刷到PCB上采用贴片机进行元件放置在回流炉（reflow oven）中多个温区进行整体加热焊接reflow soldering1.solder paste serves not only as a solder material,but also as a glue.2.the deposition of solder paste is usually conducted by the stencil or screen printing,dispensing,or pin-transferring processes.The premetered deposition of sold

13、er material onto the sites to be soldered ensures a consistent solder volume for the joints,and accordingly eliminates the insufficient solder volume problems due to the shadowing effect encountered by wave soldering.In addition,this premetered solder deposition also reduces the incidence of bridgin

14、g.Advantages of solder paste technology in SMT3.the use of mass reflow process allows a well-controlled graduate heating profile,thus eliminating potential damage of the SMCs due to the thermal shock caused by the wave soldering4.the use of solder paste allows the possibility of step soldering.5.the

15、 soldering performance of solder paste is not sensitive to the type of solder mask used on the PCBs.For the wave soldering process,a solder mask with a smooth finish is found to cause solder ball and bridging problems.Advantages of solder paste technology in SMT技术发展趋势Surface mount technology trendsT

16、echnology driving force Smaller Faster Higher complexity Lower power Lower costSpeed processing speed increases approximately five times in every 5 years;results from reduction in both on-chip delay in semiconductors and packaging delay this improvement in speed is closely associated with miniaturiz

17、ation of IC components,as demonstrated by the simultaneous reduction in line widths IC transistor integration The complexity of semiconductor chips can be measured by transistor integration.microprocessor integration has increased by 2000 since its introduction in 1970 This increase in complexity of

18、 semiconductor chips essentially drives the evolution of corresponding packaging and assembly technologyComplexity Pin count number the pin count number will increase almost 100 from the through-hole technology in the early 1980s to modules/system packaging in the late 1990s.Complexity IC feature si

19、ze Discrete component sizeMiniaturizationArea array packages Pressure of speed,complexity,and miniaturization have driven the peripheral package design down to 0.3mm(16mil)pitch for QFP 17 the rapidly increasing defect rate associated with miniaturization of peripheral design was recognized very qui

20、ckly as the bottleneck in further improvements in performance.the assembly defect rate(ppm)of QFP is a strong function of the pitch size.The defect rate is 25 to 40 ppm for 50mil pitch,and gradually increases to 25 to 100 ppm for 30mil pitch and 40 to 233 ppm(5 sigma control)for 25mil pitch.The defe

21、ct rate becomes prohibitively high,100 to 2300 ppm,for 20mil pitch.This high defect rate is primarily associated with the vulnerability of the slim,thin gullwing leads of QFP toward handling.The high precision required for the ultra-fine-pitch component placement as well as solder paste deposition f

22、urther aggrevates the problem.ball grid array(BGA)ball grid array(BGA)ball grid array(BGA)chip scale packages(CSP)A CSP is an IC area array package with size no larger than 1.2 of IC in the linear dimension,or no larger than 1.5 of IC in area.Flip chip树立质量法制观念、提高全员质量意识。22.8.822.8.8Monday,August 08,2

23、022人生得意须尽欢，莫使金樽空对月。23:59:0423:59:0423:598/8/2022 11:59:04 PM安全象只弓，不拉它就松，要想保安全，常把弓弦绷。22.8.823:59:0423:59Aug-228-Aug-22加强交通建设管理，确保工程建设质量。23:59:0423:59:0423:59Monday,August 08,2022安全在于心细，事故出在麻痹。22.8.822.8.823:59:0423:59:04August 8,2022踏实肯干，努力奋斗。2022年8月8日下午11时59分22.8.822.8.8追求至善凭技术开拓市场，凭管理增创效益，凭服务树立形象。2

24、022年8月8日星期一下午11时59分4秒23:59:0422.8.8严格把控质量关，让生产更加有保障。2022年8月下午11时59分22.8.823:59August 8,2022作业标准记得牢，驾轻就熟除烦恼。2022年8月8日星期一23时59分4秒23:59:048 August 2022好的事情马上就会到来，一切都是最好的安排。下午11时59分4秒下午11时59分23:59:0422.8.8一马当先，全员举绩，梅开二度，业绩保底。22.8.822.8.823:5923:59:0423:59:04Aug-22牢记安全之责，善谋安全之策，力务安全之实。2022年8月8日星期一23时59分4

25、秒Monday,August 08,2022相信相信得力量。22.8.82022年8月8日星期一23时59分4秒22.8.8谢谢大家！谢谢大家！树立质量法制观念、提高全员质量意识。22.8.822.8.8Monday,August 08,2022人生得意须尽欢，莫使金樽空对月。23:59:0523:59:0523:598/8/2022 11:59:05 PM安全象只弓，不拉它就松，要想保安全，常把弓弦绷。22.8.823:59:0523:59Aug-228-Aug-22加强交通建设管理，确保工程建设质量。23:59:0523:59:0523:59Monday,August 08,2022安全在

26、于心细，事故出在麻痹。22.8.822.8.823:59:0523:59:05August 8,2022踏实肯干，努力奋斗。2022年8月8日下午11时59分22.8.822.8.8追求至善凭技术开拓市场，凭管理增创效益，凭服务树立形象。2022年8月8日星期一下午11时59分5秒23:59:0522.8.8严格把控质量关，让生产更加有保障。2022年8月下午11时59分22.8.823:59August 8,2022作业标准记得牢，驾轻就熟除烦恼。2022年8月8日星期一23时59分5秒23:59:058 August 2022好的事情马上就会到来，一切都是最好的安排。下午11时59分5秒下午11时59分23:59:0522.8.8一马当先，全员举绩，梅开二度，业绩保底。22.8.822.8.823:5923:59:0523:59:05Aug-22牢记安全之责，善谋安全之策，力务安全之实。2022年8月8日星期一23时59分5秒Monday,August 08,2022相信相信得力量。22.8.82022年8月8日星期一23时59分5秒22.8.8谢谢大家！谢谢大家！