焊针介绍课件.ppt

1、Introduction of Wire Bonding CapillaryCOMPANY HISTORY Founded in 1962 as lead frame stamping house Start to manufacture wire bonding capillary since 1967 Invited the first Alumina ceramic capillary in 1970,setting the standard for wire bonding tools in use today Has been implementing the ISO 9001 re

2、quirement in Quality manual&throughout factorys operation Process 1800 Process 1800 is Gaisers patent for bottleneck portion making Highlights of Process 1800:Reliable fine pitch solutionIdeal for high frequency transducersNew improved ceramic strengthTighter toleranceLess built-up Process 1800 vs.G

3、rindingAdvantages of Process 1800:Greatly reduce Tip tolerance range and eliminate the risk of touching adjacent loopNo micro crack,grinding line and stress left compared to grinding Produce significantly greater strength,consistency and tighter tolerance range Process 1800 vs.Injection MoldAdvantag

4、es of Process 1800:Offer greater mass at WT2 for superior strength and USG transferRadius transition from the bottleneck to cone can provide better stress distribution for strength and more rigid for USG transferBottleneck height and other dimensions can be easily customizedNew Capillary Material Ma

5、terial:CZ1-Zirconia Toughened Alumina Feature:Fill tiny Zirconia particals into the voids of the ceramic molecular matrix Standard ceramicgrain size 2 umZr toughened ceramic,CZ1grain size 0.7 um:Al2O3:ZirconiaBenefits of CZ1 with Process 1800 High rigidity can provide consistent and high USG energy

6、transfer and wider tuning window 100%and great increase in bottleneck bending strength v.s.conventional capillary Improved internal bore surface can reduce wire drag and make better looping and wire control Sub-micro grain size allows for the manufacture of smaller geometries and tighter tolerance e

7、specially for ultra fine pitch capillary Resist to wear ,increase tool life,reduce costBottleneck Strength Test 1.TEST METHODApply force2 milsBottleneck Strength Test 0 05050100100150150200200250250300300350350standardstandardAl2O3Al2O3Process 1800Process 1800Al2O3Al2O3Process 1800Process 1800CZ1CZ1

8、mean bottleneck break strengthmean bottleneck break strengthgrams2.TEST RESULTComparison with competitor Process of bottleneck manufactureGaiser:Patent Process 1800M*:Mechanical Grinding S*:Injection mold MaterialGaiser:Al2O3 with Zirconia for fine pitch capillary;marked as CZ1 in P/NM*:Tough-Al2O3

9、marked as R in P/N S*:Zirconia with additives for fine pitch capillary;marked as AZ in P/N;normal is made of Al2O3 and marked as C in P/NPart No.guide to DimensionExample:1851-12-437GM-30(1.5-11D-3)20D-AB10 x8-CZ11800 processHole(1.2 mil)Length(437 mil)GM-matte finish P -polishTip(3.0 mil)IC dimensi

10、on(0.15 mil)Face angle(11degree)OR dimension(0.3 mil)Cone angle(20 degree)Bottleneck angle(10 degree)Bottleneck height(8 mil)ZrO2+Al2O3 materialHow to Contact with us Hypersonic Kaohsiung Office TEL:07-5560806FAX:07-5560803 Application Engineer:Arthur ChangTEL:0939690921 Sales Engineer:Kelvin TsengT

11、EL:0933636116 Design rule-dimensionsDesign rule-toleranceTipHoleCDORBNHstandard+/-0.3+/-0.1+/-0.2+/-0.3+2/-0Fine pitch+/-0.2+/-0.06+/-0.1+/-0.2+2/-0(mils)Design rule Ball Size Factors:1.Chamfer Diameter(H+2*IC)2.Inside Chamfer AngleDesign rule Ball Size1.Chamfer Diameter(H+2*IC)(CD+0.3mils)=Ball Siz

12、e=0.15 milsBall SizeICHDesign rule Ball Size2.Inside Chamfer AngleBigger ICA*Smaller inside volume*Bigger ball size*Bigger normal force to increase 1st bondabilitySmaller ICA*Bigger inside volume*Smaller ball sizeNormal ICA is 90 degreeDesign rule Ball Size2.Inside Chamfer AngleBigger ICA*Smaller in

13、side volume*Bigger ball size*Bigger normal force to increase 1st bondabilitySmaller ICA*Bigger inside volume*Smaller ball sizeNormal ICA is 90 degreeICAsmallerbigger12055%90100%70146%Design rule Looping Factors:1.Hole2.Radius Inside Chamfer3.Hole Angle4.Hole LengthDesign rule Looping1.HoleFor gold w

14、ire1.1 milH=WD+0.30.5HDesign rule Looping2.Radius IC *reduce sagging&wavy wire for low loop and long wire bondingDesign rule Looping3.Hole AngleGaiser design:*Hole angle=10 degreeAdvantage:*good looping *good transference of USG energy *allow for higher bottleneckDesign rule Short Tail Factors:1.Ins

15、ide Chamfer2.Chamfer Angle v.s.Face Angle3.Face AngleDesign rule Short Tail1.Inside ChamferMin.=0.15 mil(recommend)*Insufficient IC will cause weak tail bond and cannot leave enough tail length for FABTail bondClamp open;Bondhead riseStick to leave Tail lengthDesign rule Short Tail2.Chamfer Angle v.

16、s.Face Angle To provide the sharpness of cutting edge *For ICA 120 degree Higher FA is better *For ICA 90 degree Lower FA is better90120Design rule Stitch Bond Factors:1.Face Angle2.Outer Radius3.Tip surface4.T-H-2*IC-2*OR*sin(45-BTA/4-FA/2-)*cos(45-BTA/4+FA/2)Design rule Stitch Bond1.Face Angle*sma

17、ller FA provides greater downward force to increase 2nd bond bondability*smaller FA provides thinner X-section area and may cause heel crack*smaller FA is suitable while encounter lead floating and epoxy bleeding problems*normal is 8 11 degreeNormal force=F*cos(FA)FFFA90-FADesign rule Stitch Bond2.O

18、uter Radius*smaller OR,longer stitch length*bigger OR,shorter stitch lengthWDORORStitch lengthFADesign rule Stitch Bond3.Tip surface finishGaiser Matte:*provide better coupling between capillary&wire and texture stitch bond*GM is necessary for worse 2nd bondability caseGaiser Matte;GMPolishDesign ru

19、le Stitch Bond4.T-H-2*IC-2*OR*sin(45-BTA/4-FA/2-)*cos(45-BTA/4+FA/2);effective compress length:longer is betterFAEffective compress lengthT/2-H/2-ICORa1a290-a1/2a2=90+FA+BTA/2a1=90-FA-BTA/2 X=OR*sin(45-BTA/4-FA/2-)*cos(45-BTA/4+FA/2)XBTA/2Design rule Stitch Bond5.Level of OR tangent to FA:(Y/WD)*100

20、%FAEffective compress lengthT/2-H/2-ICORa1a290-a1/2XBTA/2YLevel=OR*sin(45-BTA/4-FA/2-)*cos(45-BTA/4+FA/2)*tan(FA)/WDDefect modePoor tail bond Reason:1.Inside chamfer too small2.Inside chamfer angle too steep3.Poor lead metalization4.Poor clamping5.Contamination Defect modeReason:1.Inside chamfer is

21、too small or incorrect angle2.Wire is too hard3.Wire tension/drag is not tight enough4.Incorrect vertical distance between the electrode and the end of the wire5.Excessive tail length Golf ball Defect modeRound ball Reason:CD is too large and ball size is too small.Result:1.weak adhesion or non-stic

22、k.2.capillarys tip possibly touch the pad and damage the device.(41498:round ball)(Gaiser:good formation)Defect modeWire scratch Reason:1.Damaged Inside Chamfer2.Wire from the spool has scratches3.Wire clamp surface damaged4.Wire clamp not open5.Excessive wire drag Defect modeInconsistent stitch bon

23、d widthReason:1.Due to ultrasonic motion direction.Defect modeStitch lifting Reason:1.Poor plating or metalization2.Contamination3.Lead or package not clamped rigidly,allowing the lead to move during scrubbing4.Lead surface not planar to the capillarys face5.Improper power,force or time settings6.Sm

24、all T dimension7.Capillary wear outDefect modeWeak transition Reason:1.Face angle of capillary too shallow2.Too small or sharp outside radius size due to design or wear3.Excessive force setting,causing tip to penetrate bonding pad4.Excessive power setting especially when force setting is too high5.I

25、mproper lead clamping allowing shifting of the bond Defect modeSagging wire:Reason:1.Excessive wire drag due to a hole diameter being too small2.Excessive wire drag due to the inside chamfer being too small or damaged3.Use of high elongation(soft)wire4.Use of too small of wire diameter for the loop

26、length desiredDefect modeTailingReason:1.IC angle is too shallow2.IC size is too large3.Excessive wire elongation factor4.Wire is too oldDefect modeNeckingReason:1.Insufficient force on the tool allowing the ball to wobble during scrubbing2.Free-air ball size too small,which is captured within the inside chamfer3.incorrect percent elongation of the wire allowing the wire to work harden during formation