SOP封装工艺流程介绍课件.ppt

1、1.Package Instruction2.Process Flow3.Quality Control1.SOP2.SSOP3.TSSOP4.MFPASEASEASY process flow前段制程前段制程后段制程后段制程WaferDie(chip)Die on Lead frameEpoxyLead FrameBeforeAfterLaser MarkingLaser MarkingLaser MarkingLaser MarkingLOADUNLOADGRINGINGPurpose:Grinding the wafer to Customer required thickness晶圓(

2、未研磨)研磨機晶圓(研磨後)晶元背面Wafer backsideFrameMount TapePurpose:Combine the wafer with Dicing tape onto the frame for die sawingWafer mount MachineFramePurpose:To separate dies from each other for die attachMonitorLoad/UnloadSawingCleaningMachinePurpose:Attach the dies with epoxy on substrate for the followi

3、ng processOutputDie bondSubstrate load bondWorking flow:Robber tipLead-frameEpoxyPurpose:Solidify the epoxy after D/AInsideOvenPurpose:Connecting the chip and the exterior circuitinputinputoutputBond locationTheory:Use ultrasonic,thermal,force to form the intermetallic between golden wire and joint

4、metal(Al,Au,Ag)Gold wireleadDieAl padCapillaryMold MachinePurpose:Seal the product with EMC to prevent die,gold wire from being damaged,contaminated and oxygenic.MoldingTop chaseAir vent Bottom chase Cavity Leadframe Plunger PotGate insertRunner CompoundBottom cull blockTop cull blockMoldingTop chas

5、eAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger MoldingTop chaseAir vent Bottom chase Cavity Leadframe PotGate insertRunner CompoundBottom cull blockTop cull blockPlunger After MoldMoldingTop chaseAir vent Bottom chase Cavity Leadframe PotG

6、ate insertRunner CompoundBottom cull blockTop cull blockPlunger EpoxyLead FramePurpose：Use laser light irradiated by CO2 or YAG to vapour the EMC to show content on the package，such as date,schedule,place of production and so on.laserEMC vapouredBeforeAfterLaser markingOvenInsidePurpose:To let EMC r

7、eact completely so that products can be protected more effectively.Purpose：Remove the dem-bar of leadframe.Working areaBeforeAfterLaser MarkingLaser MarkingPurpose:To plating Sn on the lead which will mount on board pad.loadunloadPlating lineAfterBefore投料區電解去膠高壓噴洗酸洗收料區活化槽電鍍槽中和槽熱D.I.水烘 乾 SOLDER PLATI

8、NG (S/P 區)ELECTRO DEFLASH (E/D區)面板操作Purpose:Remove the tie-bar and lead-frame and form products to units from strips,fill them into tubes and then pass to next process.Saw work areaunloadWorking areaunloadLaser markingWorking areaLaser markingunloadunloadLead CutFormingDie Saw切偏切偏Chipping外观检查外观检查划片宽

9、度量测划片宽度量测RejRejLead FrameEpoxyDieDie ShearEpoxy Void CheckDie AttachEpoxy Thickness&Fillet HeightDie AttachDie LocationRejWire Bond外观检查外观检查第二焊点重叠第二焊点重叠RejRejRejRej第二焊点偏移第二焊点偏移线弧不良线弧不良RejRejDie推球测试推球测试拉力测试拉力测试Wire BondWire Bond验证级工程确认验证级工程确认IMC CoverageIMC ThicknessCrater Test1st bond1st bond2nd bondLoopingMoldLooping外观检查外观检查上下错位上下错位孔洞孔洞缺角缺角溢胶溢胶内部气泡内部气泡冲线值量测冲线值量测RejRejRejRejRejPlating外观检查外观检查Solderability test镀层厚度量测镀层厚度量测170C烘烤烘烤8小时，小时，9095C蒸汽老化蒸汽老化10小时小时。锡覆盖率。锡覆盖率95%RejRejRejTirm/Form毛刺毛刺脚偏脚偏漏底材漏底材长短脚长短脚脚弯脚弯异物附着异物附着外观检查外观检查外形尺寸量测外形尺寸量测超声波扫描超声波扫描RejRejRejRejRejRej