1、Surface Mount Technology Introduction表面贴装技术简介Definition/定义2SMT-Surface Mounting Technology:SMT is a process or assembly technique by which components are soldered onto the board surface./SMT 是把零件焊接到印刷线路板表面的 工艺或装配技术.Learning Objective3 General Process Engineering Introduction/一般的工艺流程介绍一般的工艺流程介绍 SMT v
2、s THT/表面贴装技术表面贴装技术 vs 通孔装配通孔装配技术技术Composition/组成组成Assembly Classifications/装配分类装配分类Advantages/优点优点Development Trend /发展趋势发展趋势SMT defect & Countermeasure /SMT 不良不良及改善对策及改善对策 Process flow/工艺流程图工艺流程图4PrintingPaste InspectionPlacement Reflow solder Clearing PCB FA Function TestPacking FQA InspectionShip
3、pingOKNGVisual InspectionICT TESTPCBA FUNCTION TESTBox BuildingReworkNGNGOKOKNGOKVisual InspectionAOT testHand loadingWave solderOKReworkOKNGNGOKPCBA Process Flow Chart/SMT工艺流程图SMT Equipment Overview/ SMT 设备纵览5Surface Mounting TechnologyPrinterP&PP&PReflow OvenAOIQuality control point Quality contro
4、l point Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Receiving Material / 收料Part Number and QuantityStoreProcess Description:过程描述Key Parameter:关键参数 Responsibility: 责任Incoming Inspection / 来料检查Inspection on IncomingIQC6Process
5、Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Storage and Material Kiting / 物料存放Part Number, Work Order Quantity, FIFO,WIPStores Process Description: Label Application and board tracking / 贴标签板的跟踪过程描述Key Parameter:关键参数 Responsibility:
6、责任Label Verification and Correct Kit Release on NetworkMBU/制造部门7Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter: Screen Printing / 丝印Stencil selection, Supporting jig, Paste Height, Machine Parameters, Stencil cleaning, Solder Paste Usability Responsib
7、ility: IPQC,Eng.,MBU,StoresProcess Description:过程描述Key Parameter:关键参数 Responsibility: 责任 Pick and Place (surface mounting)表面贴装BOM, Loading List, LayoutQA,Eng., MBU制造部8Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Reflow / 回流Tem
8、perature Profile to Match Specific ProductEng.Process Description:Post Reflow Inspection /回流后检查过程描述Key Parameter:关键参数Responsibility:IPC-A-610, Customer BOMMBU9Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:Hand Insertion （PTH )/ 手插件Hand Insertion of C
9、omponents as per instruction / layout关键参数 Responsibility: 责任MBUProcess Description:过程描述Key Parameter:Wave soldering / 波峰焊接Temperature Profile , Flux, Solder bar, Wave pallet,关键参数 Responsibility: 责任Eng.10Process Flow/工艺流程Generic Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数 Respon
10、sibility: 责任De-panelize of PCB / 分板Tab Removal and PCB De-panelizeMBUProcess Description: Visual Inspection and Date Collection / 目检和系统跟踪过程描述Key Parameter: 关键参数 Responsibility: 责任IPC-A-610D, layoutMBU11Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键
11、参数 Responsibility: 责任Screwing / 打螺丝Torque / screw tipMBU / Eng.Process Description:过程描述Key Parameter:关键参数Responsibility:责任In Circuit Test / 在路测试Test PCB Assembly Circuitry/测试PCB装配线 路MBU12Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:关键参数Responsibilit
12、y:责任Manual Assy / 装配Fixture / Critical inspection card /夹具/鉴定检 查卡片MBU, Eng.Process Description:过程描述Key Parameter:关键参数 Responsibility: 责任Functional Test / 功能测试Functional Test or E-Prom Flash/功能测试MBU, Testing13Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parame
13、ter:关键参数 Responsibility: 责任Reliability Test / 可靠性测试Cyclical Reliability Test/循环可靠性测试OQAProcess Description:过程描述Key Parameter:关键参数 Responsibility: 责任Final Inspection / 最后检查IPC-A-610DMBU14Process Flow/工艺流程Flow ChartGeneric Process Flow / 一般的工艺流程图Process Description:过程描述Key Parameter:Label Printing / 标
14、签打印Programming / Label Printing and Serial# tracking /设计/打印标签和S/N的跟综关键参数 Responsibility: 责任Eng. , MBUProcess Description: Label Application and Packing / 贴标签和包 装过程描述Key Parameter:Apply Label to PCB and Pack with Correct User Documents/根据使用文件申请PCB和包 装的标签关键参数Responsibility:MBU责任15Process Flow/工艺流程Flow
15、 Chart/流程图Process Description:Post Pack Audit (PPA) / 封箱前检查 过程描述Key Parameter:Visual Audit on Workmanship,Labeling, Packaging,User Document Contents and Electrical Audit/目检技艺,标签,包装,使用文 件内容及有关电的审查.OQA关键参数 Responsibility: 责任Process Description:过程描述Key Parameter:Palletization and Shipping / 打包和出货Confor
16、mance to Customer Packaging Instructions/与消费者的包装只是一致关键参数 Responsibility: 责任MBU,OQAGeneric Process Flow / 一般的工艺流程图16Equipment introduction/设备介绍Screen PrintingChip PlacementQFP /BGA Placement SMT / 表面贴装技术Solder paste inspection 17Equipment introduction/设备介绍Reflow OvenWave Soldering18Equipment introduc
17、tion/设备介绍Depanelization machine / 分板机Router R-168Punching machineV-cut19Equipment introduction/设备介绍Programming & Functional TestIn Circuit TestInspection equipment / 检查设备X-ray5DXTesting equipment / 测试设备AOI20Equipment introduction/设备介绍Other equipment / 其他设备Underfill MachineBaking Oven21BGA Rework sta
18、tionSMT vs THT/表面贴装技术 vs 通孔装配技术THT stands for “Through Hole Technology”.THT components has long leads and are insert mounted through the printed circuit board. The solder joints are formed using wave soldering technology./通空元件有长的元件脚，装配时将长脚插入并穿透印刷线路 板，通过波峰焊接技术形成焊点.SMT components have no or short lead
19、s. They are mounted on the surface of the printed circuit board. The solder joints are formed using both wave soldering or reflow soldering technology表面贴装元件没有或者只有很短的元件脚，元件被贴装到印刷线路板的 表面，通过波峰焊接或者回流焊接技术形成焊点22SMT vs THT/表面贴装技术 vs 通孔装配技术23Comp Type元件类型Board Type板的类型Assembly Method装配方式Soldering Technology
20、T HT通孔技术60S80S年代Single/Double side PCB单面/双面PCBManual/Semi-auto insertion手动/半自动插件Manual soldering手工焊接70S 90S年代Single Line/ Dual In Line/ AxialSingle side/ Multiple layer PCB 单面/多层PCBManual/ Semi-auto/Auto Insertion手动/半自动/自动插件Wave soldering/ Manual soldering 波峰焊接/手工焊接SMT表面 贴装技术80S Now现在SMD, Chips, LSI
21、, VLSIHigh Density Board 高密度板Fully Automatic全自动Wave soldering/ Reflow soldering 波峰焊接/回流焊接Composition of SMT/SMT 组成24SMT is comprised of/表面贴装技术组成 Material /原料-Components/元件-Printed Circuit Board/印刷线路板-Adhesives, Solder paste, Cleaning solvents/粘胶，锡膏，清洗容剂Process 工艺-Glue dispensing/点胶-Printing/丝网印刷-Wav
22、e/Reflow soldering/波峰焊/回流焊-Inspection/Testing/检查/测试Composition of SMT/SMT 组成25SMT is comprised of/表面贴装技术组成Equipment /设备-Dispenser/点胶机-Solder paste Printer/丝网印刷机-SPI/锡膏检测-Placement/贴片机-Soldering/焊接设备-AOI/自动光学检测-In-Circuit-Test/Functional Test/ICT在线测试设备/功能测试设备Classification by Soldering Method/按焊接方式分类
23、:a. Reflow Soldering Most commonly used method./回流焊接-最常用的方法.Solder Paste Printing锡膏印刷26Component Placement元件贴装Reflow Soldering回流焊接SMT Assembly classifications/SMT装配分类SMT Assembly classifications/SMT装配分类b. Wave Soldering Method/波峰焊接方法Sufficient glue is first applied to hold the SMT component in place
24、 without interfering with other parts of the board by printing or dispensing. When the component has been placed, the glue is cured to make the bond firm. This is done by either applying heat or ultra violet radiation (UV). The THT components are inserted through the PCB and the entire board enters
25、the wave soldering machine.通过印刷或点胶在不影响板上其他部件的前提下，用足够的胶水固定表面贴 装元件在相应位置，当元件贴装完成之后，通过加热或红外线辐射将胶粘点固 化，在插上通孔元件之后，让整个板通过波峰炉进行焊接Glue Application点胶SMT component Placement SMT元件贴装Glue Curing胶水固化THT component Insertion通孔元件插装Wave Soldering波峰焊接27SMT Assembly Classifications/SMT装配分类Classification by assembly typ
26、e/按装配类型分类The assembly classifications are divided into pure SMT, single side mixed and double side mixed assembly/装配类型可以分成：纯表面贴装/单面混合贴装/双面混合贴装28Assembly ClassificationsSchematicSubstrateSoldering MethodRemarksSingle Sided SMTSingle side PCB Ceramic boardSingle ReflowSimple, suitable for small and th
27、in productsDouble Sided SMTDouble side PCB Ceramic boardDouble ReflowSuitable for high density and thin productsSMD and THC On Side ADouble side PCBSide A Reflow Soldering Side B Wave SolderingUsually the SMT is done prior to THTTHC on side A SMD on side BSingle side PCBSide B Wave SolderingUsually
28、the SMT is done prior to THT. The cost of PCB is lowTHC on side ASMD on both side A and BDouble side PCBSide A Reflow Soldering Side B Wave SolderingSuitable for high density and complex productsTHC and SMD on both side A and BDouble side PCBSide A Reflow Soldering Side B Wave SolderingTHC on side B
29、 maual solderingRarely used because of the complicated processesMixed TechnologyMixed Technology (Low Component Density) 混合安装（低元件密度）a. For single side PCB:/对于单面PCBSide A -29b.For double side PCB:/对于双面PCBSide B -Printing印刷SMC Pacement SMC贴片Reflow Soldering回流焊接THC Insertion通孔元件插装Wave Soldering波峰焊接Glue
30、 Application点胶SMC Placement SMC贴片Glue Curing胶水固化THC Insertion通孔元件插装Wave Soldering波峰焊接Side A -Mixed TechnologyMixed Technology (High Component Density) 混合装配技术（高元件密度）Printing丝印SMC Placement SMC元件贴装Reflow Soldering回流焊接THC Insertion通孔元件插装Wave Soldering波峰焊接Side A -Side B -Side A -Glue Application点胶SMC Pl
31、acement SMC元件贴装Glue Curing胶水固化30SMT Advantages/SMT的优点31Why using SMT/为什么要使用SMTIncreased Density/增加密度vSMC is only 1/3 1/10 in size compared THT components, as such the board real estate can be maximized and the weight of the assembled board is reduced. By using SMT, the assembled product could be red
32、uced by 40%60% in size and by60%80% by weight表面贴装元件只有通孔元件大小的1/3 1/10，这样板可以得到最大限度的利用同时装配 后的板重量会减轻，与通孔装配相比，表面贴装的大小可以缩小40%60%， 重量可以 减轻60%80%Increased Reliability/增强可靠性vSMC has no or short leads; therefore they are light weighted and possess good resistance to shock and vibration. In comparison to THT,
33、the SMT component can reduce the solder joint failure in the order of 10.表面贴装元件没有或只有很短的元件脚,因而重量很轻并且具有良好的抗冲击/震动性能，与THT相比，SMT焊点故障能够减少10倍SMT Advantages /SMT的优点32Why using SMT/为什么要使用SMTIncreased Performance/提升性能vSMT offers better interconnectivity due to shorter paths, providing lower inductance and cap
34、acitance.表面贴装有更短的连接线路因此拥有更好的连接性能，更低的电感/电容系数vSMT reduces the package propagation delay, which is the time the signal needs to move from one component to another. (Typically the longest delays in the system are off-chip). In comparison, THT components will not work if the operating cycle is more than
35、500Mhz.表面贴装技术减少了由于封装引起的传导延迟，传导延迟指的是信号从一个元件传到另 外一个元件的时间。（通常系统里最长的延迟在元件与元件之间），相比较而言，如果 系统的工作频率超过500Mhz，通孔元件将不能工作Increased Efficiency/提升效率vSMT is more suitable for large scale automated production. By using the CIMS, the production process is highly automated, and it brings the efficiency to a even hig
36、her level自动贴片技术更适合大批量自动化生产，通过运用CIMS，生产工艺高度自动化，并且 将将效率带到一个更高的层次SMT Advantages/SMT的优点33Why using SMT/为什么要使用SMTReduced Cost/节约成本vSMT reduces the cost of bare boards, simplify the assembly process and reduce the cost related to THT equipment. It is expected that the cost of the manufacturing could be re
37、duced by as much as 30% when using SMT表面贴装技术减少光板成本，简化装配工艺，节约相应的通孔工艺设备的成本，与通孔 技术装配相比，表面贴装技术可以节约30%的制造成本。SMT Development Trend/SMT发展趋势34Lead Free and No Clean Soldering Process/无铅和免清洗焊接工艺The environment concern of lead toxicity has pushed the search for the alternative material of Pb-Sn eutectic solde
38、r.铅的毒性引起的环境方面的顾虑推动锡铅合金焊剂的替代产品的研究Ideal Sn-Pb solder replacement should possess the following characteristics:/理想的锡铅焊 料的替代品应该拥有如下特性-Low melting point similar to Sn-Pb (close to 183oC, should not be higher than 200oC)与锡铅类似的低熔点（接近183oC，不高于200oC ）-Low cost/低成本-Mechanical strength and resistance to therma
39、l fatigue similar to that of Sn-Pb机械强度和热疲劳系数与锡铅类似-Compatible with the current equipment and process used in production兼容目前生产中的设备和工艺-Good wetting and mechanical stress reliability良好的焊接性能和机械应力可靠性-Good electrical conductivity良好的电传到性能Lead Free and No Clean Soldering Process/ 无铅和免清洗焊接工艺Current Lead Free
40、development status/当前无铅的发展状态35- Binary（二元） Sn-Bi/锡-铋, Sn-In/锡-铟, Sn-Ag/锡-银, Sn-Zn/锡-锌- Ternary （三元） Sn-Ag-Cu/锡-银-铜, Sn-In-Cu锡-铟-铜, Sn-In-Ag锡-铟-银The most promising Sn-Pb replacement candidate is Sn96.5-Ag3.0-Cu0.5. The melting temperature of which is at 217oC/锡铅替代品候选者是：锡95.5-银3.8-铜0.7，这 种合金的熔点是217oCS
41、MT Development Trend/SMT发展趋势Trends in Chip Component/片式元件的趋势Size Trends & Life Cycle/片式元件大小趋势&生命周期12060805060304020201 01005Driven by system miniaturization and lower manufacturing cost 系统小型化和减小制造成本推动片式元件发展0201/01005 Size Market Penetration 0201/01005开始渗透市场 0603 market share already in decline 0603市
42、场开始下滑 0402 has moved beyond mobile phones 0402 撤离手机市场 0201 widely used in RF modules from 0201广泛运用于无线电产品36Progression of Packaging/封装方式的发展Quad Flat PackTape Carrier PackageLeads to BallsWires to BumpsPackages to PackagelessBall Grid ArrayFlip Chip Ball Grid ArrayFlip Chip In Package (FCIP)(near Pack
43、ageless)Chip Size PackageFlip Chip On Board (FCOB)Source: TechSearch International, Inc.37SMT defect & countermeasure/SMT 不良及改善措施不良及改善措施38Defects Identification：Identify the SMT defects according to IPC-A-610 (Rev: F) IPC-A-610 standard is a collection of visual quality acceptability for electronic
44、assemblies (PCBA). Excess solder 多锡多锡39 1. Excess solder paste: Root cause:1).Solder paste height out of UCL 2). Nonstandard of stencil aperture opening. Action:1). Adjust printing machine to under control the paste height. 2). To standard the stencil aperture opening. 2. Low conveyer ramp, long wav
45、e soldering time: Adjust conveyor ramp angle to 57 degree and soldering time to 35 second (wave solder). 3. High preheat temperature to dry off the flux: According to flux spec to control the preheat temperature, at normally the PCB surface preheat temperature should under 100 degree C (wave solder)
46、.Typical Soldering Defects and Troubleshoot/典型的焊接缺陷和解决方法典型的焊接缺陷和解决方法Typical Soldering Defects and Troubleshoot/典型的焊接缺陷和解决方法典型的焊接缺陷和解决方法40Solder Bridging /短路短路Occurrence: Due to poor print/component place misalignment and/or due to over deposition of solder. /印刷或贴片偏位或多锡Troubleshoot/解决方法:1) Check the
47、print alignment setting /检查锡膏印刷正确 2) Check design of PCB /检查PCB焊盘3) Check design of the stencil/检查网板设计Typical Soldering Defects and Troubleshoot/典型的焊接缺陷和解决方法典型的焊接缺陷和解决方法Solder Balls/锡球锡球Troubleshoot/解决方法:1)Make sure the bottom side of the stencil is clean/确认网板底部是否干净2) Make sure misprinted boards are
48、 cleaned well and no waste paste is left on the board确认错印的板是否清晰干净3) Make sure Stencil aperture is correct确认网板开孔是否正确41No solder 无锡无锡421. Missing printingRoot cause:1). Stencil aperture was jammed. 2). High viscosity of solder paste.Action:1). Clean stencil; 2). Replace the recycled paste with fresh o
49、ne. 3). Printing machine parameter adjustment. 2. Poor solder ability of component or pad Root cause:1).Old date date component or PCB. 2).Contamination on component or PCB. Action: Hold the lot material for further dispositionTypical Soldering Defects and Troubleshoot/典型的焊接缺陷和解决方法典型的焊接缺陷和解决方法Typica
50、l Soldering Defects and Troubleshoot /典型的焊接缺陷和解决方法典型的焊接缺陷和解决方法Tombstoning/墓碑现象Occurrence: Due to different and unbalanced surface tension force between two end-terminals of chip parts. This results in the device lifting on one side after reflow.原因:由于元件两端的表面张力不平衡导致在回流焊时元件一端升起Troubleshoot/解决方法:1) Mini
