1、Page1競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 鋁基板制作流程介紹鋁基板制作流程介紹 Page2競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 一、鋁基板制程一、鋁基板制程 1 1、噴錫流程：、噴錫流程：來料檢查 一次沖/ 鑽孔圖形轉移圖形檢查蝕刻退膜蝕檢阻焊制作 打定位孔字符制作噴錫噴錫檢查單面磨板（依客戶要求而定） V-CUT/成型通斷測試高壓測試FQC、FQA包裝入庫Page3競華電子競華電子( (深圳深圳) )有限公司有限公司A+
2、PCB Electorics(Shen Zhen)Co.,LTD 2 2 、OSP OSP 流程流程来料检查一次冲/ /钻孔图形转移图形检查蚀刻退膜蚀检阻焊制作打定位孔字符制作V-CUT/V-CUT/成型测试FQCFQC、FQAFQAOSPOSPFQCFQC包装入库 Page4競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD二、制程制作事项二、制程制作事项 2.1 2.1来料检查来料检查IQCIQCA、铜面检查：不允许有凹坑、擦花和严重氧化痕迹；Cu surface check: Notches, scratches an
3、d serious oxidation are not allowed.B、保护膜检查：保护膜不应有破损至铝面露出；Protective film check: Protective film mustnt be broken withCu exposure.C、厚度检查：按流程卡要求检测板厚、铜厚。Thickness check: Check board thickness and Cu thickness according to lot card. Page5競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.22
4、.2一次冲一次冲/ / 钻孔钻孔One-time Hole-punching/One-time Hole-punching/drillingA、一次冲/ / 钻孔主要冲管位孔和工艺孔，孔位和孔徑均要符合图纸要求；One-time hole-punching/drilling is mainly to punchorientation-hole and technical hole. The hole-position and hole-diameter must be consistent with drawing requirement.B、冲/钻板方向为从铜面到铝面，可有效避免铝面擦花；P
5、unching/drilling direction is from Cu surface to Al surface,which can effectively avoid scratches of Al surface. Page6競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.32.3、图形转移、图形转移Image TransferImage TransferA、磨板Scrubbinga、为提高干膜和保护膜面的结合力，防止保护膜面干膜、脱落，可轻磨保护膜面；In order to improve the com
6、bination of dry film & protective film and to avoid falling off dry film on the protective film, it is necessary to lightly scrub the surface of protective film.b 、不允许有板面氧化和胶渍现象。Oxidation and left glue stains on the board surface cannot be allowed. Page7競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(She
7、n Zhen)Co.,LTD B B 贴膜贴膜FilmFilma、干膜种类： *film type: *b 、预烘和贴膜时间间隔要尽量短。The interval between pre-cure and film- pasting time should be as short as possible C C、静置冷却Placing and CoolingPlacing and Cooling.為了對位的准确，需將已貼膜的鋁基板靜置冷卻至室溫。In order to assure accurate registration, it is necessary to place aluminou
8、s board with pasted film for a while until it reaches room temperature. Page8競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD D D、曝光a、负片黄菲林；Negative Yellow Filmb、注意丝印孔对位的准确性。Pay attention to the registration accuracy of silkscreening hole. E E 、静置PlacingPlacing线路部分发生光聚反应, 经15min左右充分聚合。Th
9、e light-gathering reaction happens at the circuit part and reaches full aggregation after 15 minutes. F F 、显影DevelopingDeveloping Page9競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.4 2.4 圖形檢查圖形檢查Image CheckImage CheckA 、檢查重點在于開路、短路、缺口、顯影不淨等；Mainly check open circuit, short circuit,
10、gap andunclean developing etc.B 、修板時不能用黑油筆，只能用黑油補；Black oil-pen cannot be used when mending board but black oil. Page10競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.5 2.5 蚀刻蚀刻A、必须在首板试验合格方可批量生产；It is obligatory to conduct mass production after the first batch of boards is confirmed t
11、o be qualified.B、不允许有保护膜破损现象，如发现保护膜破损，则应先用皱纹胶贴好再过机蚀刻；The dilapidation of protective film is not allowed and if the protective film is broken, it should use adhesive tape to mend it before placing boards on the etching machine.C、尽量控制一次蚀刻干净；Assure one-time clean etching as possible as it can.D、图形内任何地方
12、的残铜或绝缘层上的垃圾都不允许用刀片来刮；Using knife to scrape off left Cu on any part of the pattern or the dirt on the insulated layer is not allowed. Page11競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.6 2.6退膜退膜/ /清洗清洗Film-stripping/CleaningFilm-stripping/CleaningA、退膜不能浸泡在退膜缸中，必须直接过机退膜，一次性退膜干净；To st
13、rip the films clearly at one time, use tackle roller instead of immersing in the stripping chemistry.B、退膜过程中残留在板面的药水会影响铝基板成品的耐用程度，故需对剥膜后的铝基板进行有效的清洗；The residues of the stripping chemistry would affect the durability of the IMS, so which need efficient cleaning after stripping films.C 、退膜干净后的铝基板必须进行烘
14、干处理后方可往下流程；Baking is required after stripping.D 、所有铝基板均不能进行手动蚀刻；No manual etching is allowed.E 、如有蚀刻不净的板子，可进行快速过机返蚀;If etching was not well done, re-etch is needed quickly.Page12競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.72.7蚀刻检查蚀刻检查Etching CheckEtching CheckA、绝缘层上的任何地方都不允许用刀片来刮；
15、Using knife to scratch any part of the insulated layer is not allowed.B、主要检查短路、缺口、开路，报废单元不能钻孔，只能用黑油笔打“” ；Mainly check short circuit, gap, open circuit.Abandoned unit mustnt be drilled and can only be marked with “X” by black oil-pen. Page13競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD
16、2、8阻焊制作阻焊制作Solder Mask MakingSolder Mask MakingA A、单面磨板（线路面），不允许板面有氧化和胶渍现象；Single-side scrubbing (circuit side). Oxidation and glue stains on the board surface are not allowed.B B、待板子冷却至室温后印阻焊Print solder mask after the board is cooled into room temperature.C C、待铝基板冷却至室温后，方可对位曝光；Register and expose
17、aluminous PCB after it is cooled into room temperature.a 、对位前应认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工；Before registration, it is necessary to seriously check if the sensitization oil accumulates on the board surface or is uneven. If there is a lot of sensitization oil on the board surface, it must re- process
18、 such boards in time.b 、对位时应注意菲林与板面MARK点的同心度；During registration, it is necessary to pay attention to the concentricity of the film and mark point. Page14競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTDD、曝光：ExposingE、顯影：DevelopingF、檢查：重點檢查顯影不淨和綠肥油上焊盤；Check: Mainly check unclean developin
19、g and solder mask on the PAD.G、無特殊要求的板在顯影后須撕掉鋁面保護膜，鋁面不能有膠漬和保護膜殘留；It must rip off the protective film on the Al surface after developing forunspecialized boards. Glue stains and protective film leftover on the Alsurface are not allowed.注：若有特殊要求，則在顯影后及全制程都不可撕掉鋁面保護膜；Remark: If the customer has special
20、requirements, the protective filmmustnt be ripped off after developing even during the whole production.H 、返洗绿油板返洗绿油前不能撕掉铝面保护膜，并检查有无破损，如有必须用皱纹胶纸贴好。The protective film cannot be ripped off before washing off solder maskfor re-process and should be checked if is broken. If the protective film isbroken
21、, it must be mended with adhesive tape. Page15競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD如下工序为打定位孔工序必须先固化阻焊后在送板如下工序为打定位孔工序必须先固化阻焊后在送板下工序。下工序。 2.92.9打定位孔打定位孔Orientation-hole PunchingOrientation-hole PunchingA 、用层压打靶在做好的线路相应靶位图上打靶。Punch orientation-hole at corresponding position of th
22、e board with finished circuits by layerpressing punching Page16競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.102.10字符制作字符制作( (根据根据MIMI要求而定要求而定) Component Mark) Component MarkMaking (based on the requirement of MI)Making (based on the requirement of MI)A 、每印一块工作板后都需认真自检，合格后再继续印刷，不合格板
23、需分开及时返工；Conduct self-check for every printed working boardand continue printing when the previous one isconfirmed to be qualified. Unqualified boards must beseparated from qualified ones and be re-processed intime.B、字符不允许有模糊、重影、残缺、渗油等现象；Component mark mustnt be ambiguous, broken, oilseeped or with g
24、host image.Page17競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.11 喷锡喷锡HALSHALSA、锡炉温度控制在*；The Tin-oven temperature is controlled within*.B、喷锡后要充分冷却后方可进行后处理；Conduct post-treating when the board is fully cooled after HALS.C、后处理的热水洗段要将板面充分清洗干净，防止板面哑色；Completely clean the board surface a
25、t the hot-waterwashing section of the post-treating to avoid dim colorof the board surface.Page18競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.12 2.12 喷锡检查喷锡检查HALS CheckHALS CheckA、锡面平整，无锡堆、锡高等现象；The Tin surface must be smooth without Tin-piling andhigh Tin.B 、所有焊点不允许有不上锡现象；Assure a
26、ll solder points are covered with Tin.C 、MARK.一定要平整，不允許錫面凸出或錫面不均勻；All MARK points must be smooth. It is not allowed thatthe Tin surface is protruded or uneven.D、錫面顏色一致，光亮度要好，不允許有啞色；The color of Tin surface must be unified with goodbrightness and no dim color.Page19競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Ele
27、ctorics(Shen Zhen)Co.,LTD 2.132.13单面磨板（视客户要求而定）单面磨板（视客户要求而定） Single-sideSingle-sideScrubbing (according to customers requirements)Scrubbing (according to customers requirements)A 、磨板前要彻底洗机、换水，水洗缸；Completely clean the machine and change dirty water beforescrubbing and there must be *B、磨刷使用毡辘，前磨刷为*#，后
28、磨刷为*#，磨痕试验宽度为*mm；Using felt tackle for scrubbing. The type of former scrubbingbrush is *# and the latter is *#. The tested width of scrubbingtrace is within *mm.C、磨板前要注意清洗烘干段行辘；Pay attention to cleaning transporting tackle at the baking sectionbefore scrubbing.D、磨板时只使用一对上磨刷，线路面向下，注意下磨刷要关闭；Use a pair
29、 of upper scrubbing brush for scrubbing. Put the circuitside adown and turn off the nether scrubbing brush.Page20競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTDE、铝面如有擦花，须用*#砂纸打磨平整后再磨板If there are scratches on the Al surface, it is necessary to use *# sand paper to smooth the board and t
30、hen conduct scrubbing.F、不能污染锡面，不能有哑色现象；The Tin surface mustnt be polluted and shouldnt has dim color.G、铝面磨板要均匀，不能有没磨到的地方；All parts of the Al surface must be scrubbed evenly.H、在铝面、锡面检查合格后，铝面须贴透明专用保护薄膜；Paste special colorless protective film on the Al surface after the Al and Tin surfaces are confirme
31、d to be qualified.Page21競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD2.14 V-CUT2.14 V-CUTA、使用电脑V-CUT；Apply computer-assistant V-CUT.B、在V-CUT过程中不能撕掉或揭开胶纸，更不能用手去摸铝面；During the course of V-CUT, it mustnt rip off or uncover the gummed paper and touch the Al surface by handPage22競華電子競華電子(
32、(深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD2.152.15成型成型MouldingMouldingA A、在冲压过程中全程都不能撕掉或揭开胶纸，更不能用手去摸铝面；、在冲压过程中全程都不能撕掉或揭开胶纸，更不能用手去摸铝面；During the whole production, it mustnt rip off or uncover the gummed paper and touch During the whole production, it mustnt rip off or uncover the gummed paper
33、 and touch the Al surface by hand.the Al surface by hand.B B、冲压过程要从线路面冲到铝面；、冲压过程要从线路面冲到铝面；The punching & pressing direction is from circuit side surface to. AlThe punching & pressing direction is from circuit side surface to. AlC C 、铝面不能有明显的披锋；、铝面不能有明显的披锋；There mustnt be obvious burs on the Al surfa
34、ce.There mustnt be obvious burs on the Al surface.D D 、不能被压伤，线路面不能有任何污染；、不能被压伤，线路面不能有任何污染；The board mustnt be broken when pressing and the circuit side mustnt be polluted.The board mustnt be broken when pressing and the circuit side mustnt be polluted.E E、不能有绝缘层脱落现象；、不能有绝缘层脱落现象；The insulated layer m
35、ustnt be fallen off.The insulated layer mustnt be fallen off.F F、外形及管位要符合设计的公差要求；、外形及管位要符合设计的公差要求；The tolerance of outline and controlling position should be consistent with design The tolerance of outline and controlling position should be consistent with design requirement.requirement.G G、在冲压过程中要注
36、意模具上、下模的清洁，任何的金属屑存在都会导致绝缘、在冲压过程中要注意模具上、下模的清洁，任何的金属屑存在都会导致绝缘层的破坏，从而影响其电气性能；层的破坏，从而影响其电气性能；Pay attention to cleaning the upper and nether molds during punching & pressing for Pay attention to cleaning the upper and nether molds during punching & pressing for any metal crumb may result in the damage of
37、 insulated layer and influence the any metal crumb may result in the damage of insulated layer and influence the electrical capacity of PCB.electrical capacity of PCB.Page23競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD2.16高压测试高压测试High-pressure TestHigh-pressure TestA、为了保证铝基板有足够的绝缘强度，
38、需按客户要求100%作耐高压测试；In order to assure sufficient insulated intensity for the aluminous PCB, the high-pressure test must be operated according to customers requirements.B 、耐压测试电压为*KV（DC），漏电电流为*mA/PCS；The pressure of high-pressure test is *KV（DC）and the creepage current is*mA/PCS.C 、耐压测试时如有漏电现象则需逐片测试，找出
39、漏电单元；If there is creepage of high-pressure test, it must test board one by one to find out the creepage unit.D 、测试者要穿绝缘胶鞋，戴绝缘手套，以免觸电；Testers must wear insulated rubber overshoes and insulated gloves to avoid electrical hurt.Page24競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.17 OSP2
40、.17 OSPA、OSP膜厚在要求范圍內；The OSP film thickness must be in the required scope.B、OSP膜均勻；The OSP film should be even.C、鋁面不能有變色及划傷。The color of Al surface cannot be changed and the Alsurface mustnt be scratched.Page25競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD2.18 FQC2.18 FQC、FQAFQA检查检查FQC
41、 and FQA CheckFQC and FQA CheckA 、按下列铝基板品质标准结合客供标准进行检查Check the board according to the combination ofaluminous PCB standard below and customer standard.B、在检查过程中将铝面胶纸揭去，用白纸隔开存放；Uncover the gummed paper on the Al surface duringchecking and separate the boards with white paper.C 、在检查过程中不能污染铝面和线路面；The A
42、l surface and circuit side cannot be polluted during checking.Page26競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.19 2.19 包装入库包装入库PackingPackingPage27競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD三、注意事項三、注意事項NoticeNotice 3.1 各工序必须生产严格按要求操作；All processes must be strictl
43、y operated in accordance with requirements. 3.2 生产全程中的运输，必须插猪笼架，或者垫纸或胶片隔开，避免擦花；Put boards in the cage-shelf or separate them with paper or plasticsheet to avoid scratches during transportation of the whole production. 3.3生产全程中，任何工序都不能用刀片刮绝缘层；Using knife to scratch insulated layer in any process is n
44、ot allowed during the whole production. 3.4对于报废板，不能在基材上钻孔，只能用黑油笔打“”；For abandoned boards, the base material cannot be drilled but is only marked with “” by oil-pen.Page28競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 3.5 图形检查要做到全检，任何图形问题在蚀刻后都无法返工Total pattern inspection is a must becau
45、se there is no way back to solve the pattern problem after etching. 3.6 外发工序要严格按照我公司标准进行来料全检；Conduct 100% IQC check for all out-sourcing boards according to our companys standard. 3.7 成品锡面哑色、铝面擦花等缺陷板集中起来，统一返工；Gather all defective boards together (such as dim color & scratches of the Al surface) to b
46、e re-processed. 3.8 生产中如有问题，要及时反馈给相关工艺人员来解决。For any problem during production, it must be informed to related technical staff in time to be solved.1、有事业的峰峦上，有汗水的溪流飞淌；在智慧的珍珠里，有勤奋的心血闪光。2、人们走过的每一个足迹，都是自己生命的留言；留给今天翻过的日历，留给未来永久的历史。3、人生是一座可以采掘开拓的金矿，但总是因为人们的勤奋程度不同，给予人们的回报也不相同。4、理想之风扯满人生的帆；奋斗之杆举起理想之旗。5、人应该学
47、会走自己的路，但更应该掌握手中的罗盘。6、不能因为人生的道路坎坷，就使自己的身躯变得弯曲；不能因为生活的历程漫长，就使求索的脚步迟缓。7、人生的意义在理想的光辉中闪烁；生命的价值在创造的生活中闪现。8、只有走完平凡的路程，才能达到伟大的目标。9、奋斗目标是人生的精神支柱。10、共同的事业，共同的斗争，可以使人们产生忍受一切的力量。奥斯特洛夫斯基11、属于每个人的道路，都在每个人的足下；属于每个人的历史，都在每个人的身后。12、终于有一天，海水和泪都是甜的。13、有志者自有千方百计，无志者只有千难万难。14、贫不足羞，可羞是贫而无志。吕坤15、人，只要有一种信念，有所追求，什么艰苦都能忍受，什么
48、环境也都能适应。丁玲16、人生的途程是遥远的，只要双脚不息地前行，道路就会向远方延伸。17、理想是人生的坚实支柱，如果失去了生活的理想，精神也就会随之而瘫痪。18、目标不是都能达到的，但它可以作为瞄准点。28、我学习了一生，现在我还在学习，而将来，只要我还有精力，我还要学习下去。别林斯基29、任何时候我也不会满足，越是读书，就越是深刻的感到不满足，越是感到自己的知识贫乏。马克思30、外国语是人生斗争的一种武器。马克思31、学习这件事不在乎有没有人教你，最重要的是在于你自己有没有觉悟和恒心。法布尔32、笔落惊风雨,诗成泣鬼神。杜甫33、别裁伪体亲风雅,转益多师是汝师。杜甫28、我学习了一生，现在我还在学习，而将来，只要我还有精力，我还要学习下去。别林斯基29、任何时候我也不会满足，越是读书，就越是深刻的感到不满足，越是感到自己的知识贫乏。马克思30、外国语是人生斗争的一种武器。马克思31、学习这件事不在乎有没有人教你，最重要的是在于你自己有没有觉悟和恒心。法布尔32、笔落惊风雨,诗成泣鬼神。杜甫33、别裁伪体亲风雅,转益多师是汝师。杜甫
