1、2022年10月1日星期六pcb板制作工艺流程介绍板制作工艺流程介绍Pre-engineeringPattern imagingEtchingLaminatingDrillingCu platingHole pluggingPattern imagingLaminationLaser AblationMechanical drillingPattern imagingCu platingSolder MaskSurface FinishedRoutingVisual inspectionElectric testShippingpcb板制作工艺流程介绍Pre-engineeringPatter
2、n imagingEtchingLaminatingDrillingpcb板制作工艺流程介绍DesmearCu platingHole pluggingCu platingBelt Sandingpcb板制作工艺流程介绍LaminationLaser AblationMechanical drillingCu platingPattern imagingpcb板制作工艺流程介绍Solder MaskGold platingRoutingElectrical testPattern imagingpcb板制作工艺流程介绍Hole counterShippingVisual inspectionp
3、cb板制作工艺流程介绍*Raw material(Thin Core,Copper,Prepreg.)Raw Material Raw Material :FR-4(Difuntional,Tetrafuntional):FR-4(Difuntional,Tetrafuntional)Supplier Supplier :EMC,Nan-Ya:EMC,Nan-YaSheet sizeSheet size :36 :36”*4848”,40,40”*4848”,42,42”*4848Core ThicknessCore Thickness:0.003:0.003”,0.004,0.004”,0.
4、005,0.005”,0.006,0.006”0.008 0.008”,0.010,0.010”,0.012,0.012”,0.015,0.015”0.021 0.021”,0.031,0.031”,0.039,0.039”,0.047,0.047”Copper Foil Copper Foil :1/3 oz,1/2 oz,1.0 oz,2 oz:1/3 oz,1/2 oz,1.0 oz,2 ozPrepreg type Prepreg type :1080,2113,2116,1506,7628,7630:1080,2113,2116,1506,7628,7630pcb板制作工艺流程介绍1
5、.內層基板(THIN CORE)LaminateCopper Foil裁板裁板(Panel Size)(Panel Size)COPPER FOILCOPPER FOILEpoxy GlassEpoxy Glasspcb板制作工艺流程介绍Photo ResistPhoto Resist2.內層線路製作(壓膜)(Dry Film Resist Coat)Etch Photoresist(D/F)Etch Photoresist(D/F)pcb板制作工艺流程介绍Photo ResistPhoto Resist3.內層線路製作(曝光)(Expose)A/WA/WArtworkArtwork(底片底片
6、)ArtworkArtwork(底片底片)After ExposeAfter ExposeBefore ExposeBefore Exposepcb板制作工艺流程介绍4.內層線路製作(顯影)(Develop)Photo ResistPhoto Resistpcb板制作工艺流程介绍5.內層線路製作(蝕刻)(Etch)Photo ResistPhoto Resistpcb板制作工艺流程介绍6.內層線路製作(去膜)(Strip Resist)pcb板制作工艺流程介绍7.黑氧化(Oxide Coating)pcb板制作工艺流程介绍8.疊板(Lay-up)LAYER 2LAYER 3LAYER 4LAY
7、ER 5LAYER 1LAYER 6Layer 1Layer 1Layer 2Layer 2Layer 3Layer 3Layer 4Layer 4Copper FoilCopper FoilInner LayerPrepreg(膠片)Prepreg(膠片)pcb板制作工艺流程介绍9.壓合(Lamination)pcb板制作工艺流程介绍典型之多層板疊板及壓合結構典型之多層板疊板及壓合結構.COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core,FR-4Thin Core,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepre
8、g prepreg Thin Core,FR-4Thin Core,FR-4prepreg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合用之鋼板疊合用之鋼板10-1210-12層疊合層疊合壓合機之熱板壓合機之熱板壓合機之熱板壓合機之熱板COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core,FR-4Thin Core,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core,FR-4Thin Core,FR-4prep
9、reg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZ疊合用之鋼板疊合用之鋼板疊合用之鋼板疊合用之鋼板pcb板制作工艺流程介绍墊木板鋁板10.鑽孔(Drilling)pcb板制作工艺流程介绍11.電鍍Desmear&Copper Depositionpcb板制作工艺流程介绍12.塞孔(Hole Plugging)13.去溢膠(Belt Sanding)pcb板制作工艺流程介绍14.減銅(Copper Reduction)Option15.去溢膠(Belt Sanding)Optionpcb板制作工艺流程介绍16.外層壓膜 Dry Film Lamina
10、tion(Outer layer)Photo Resistpcb板制作工艺流程介绍17.外層曝光 ExposeUV光源pcb板制作工艺流程介绍18.After Exposedpcb板制作工艺流程介绍19.外層顯影 Developpcb板制作工艺流程介绍20.蝕刻 Etchpcb板制作工艺流程介绍20.去乾膜 Strip Resistpcb板制作工艺流程介绍21.壓合(Build-up Layer Lamination)RCCRCC(R Resin esin C Coated oated C Copper foil)opper foil)pcb板制作工艺流程介绍21.護形層製作(壓膜)(Conf
11、ormal Mask)Dry FilmDry Film(乾膜乾膜)Dry FilmDry Film(乾膜乾膜)pcb板制作工艺流程介绍ArtworkArtwork(底片底片)ArtworkArtwork(底片底片)22.護形層製作(曝光)(Conformal Mask)Before ExposureAfter Exposurepcb板制作工艺流程介绍23.護形層製作(顯像)(Conformal Mask)pcb板制作工艺流程介绍24.護形層製作(蝕銅)(Conformal Mask)pcb板制作工艺流程介绍25.護形層製作(去膜)(Conformal Mask)pcb板制作工艺流程介绍26.雷
12、射鑽孔(Laser Ablation)及機械鑽孔pcb板制作工艺流程介绍Mechanical DrillMechanical Drill(P.T.H.)(P.T.H.)Laser Microvia(Blind Via)27.機械鑽孔(Mechanical Drill)pcb板制作工艺流程介绍28.電鍍(Desmear&Copper Deposition)pcb板制作工艺流程介绍29.外層線路製作(Pattern imaging)壓膜壓膜(D/F Lamination)(D/F Lamination)pcb板制作工艺流程介绍曝光曝光(Exposure)(Exposure)顯像顯像(D/F Dev
13、eloping)(D/F Developing)pcb板制作工艺流程介绍蝕銅蝕銅 (Etching)(Etching)去膜去膜(D/F Stripping)(D/F Stripping)pcb板制作工艺流程介绍30.防焊(綠漆)製作(Solder Mask)pcb板制作工艺流程介绍WWEI94V-0R10531.S/M 顯像(S/M Developing)32.印文字(Legend Printing)pcb板制作工艺流程介绍33.浸金(噴錫)製作(Electroless Ni/Au,HAL)WWEI94V-0R105pcb板制作工艺流程介绍WWEI94V-0R105Dedicate or un
14、iversal Tester Dedicate or universal Tester Flying Probe Tester Flying Probe Tester 34.成型(Profile)35.測試(Electrical Testing)pcb板制作工艺流程介绍WWEI94V-0R105WWEI94V-0R10536.終檢(Final Inspection)37.O.S.P.(entek plus Cu_106A.)Optionpcb板制作工艺流程介绍LASER BLIND&BURIED VIA LAY-UPLASER BLIND&BURIED VIA LAY-UPA=THROUGH
15、VIA HOLE(導通孔導通孔)B=BURIED VIA HOLE(埋孔埋孔)C=One Level Laser Blind Via (雷射盲孔雷射盲孔)LASER BLIND&BURIED VIA LAY-UPLASER BLIND&BURIED VIA LAY-UPBURIED VIA AND LASER BLIND VIA OPTION(BURIED VIA AND LASER BLIND VIA OPTION(雷射盲埋孔之選擇雷射盲埋孔之選擇)D DC CC CD=Two Level Laser Via(雷射盲孔雷射盲孔)C CD DC CB-STAGEB-STAGEFR-4 Core
16、RCCRCCFR-4 CoreB-STAGEB-STAGERCCRCCA AB BB BA Apcb板制作工艺流程介绍BURIED VIA LAY-UPBURIED VIA LAY-UPA=THROUGH VIA HOLE(導通孔導通孔)B=BURIED VIA HOLE(埋孔埋孔)C=BLIND VIA HOLE(盲孔盲孔)D=BLIND HOLE MLB VIA(多層盲孔多層盲孔)BLIND VIA LAY-UPBLIND VIA LAY-UPBLIND VIA SEQUENTIAL LAY-UPBLIND VIA SEQUENTIAL LAY-UPA AB BB BA AR RE ES
17、SI IN NB-STAGEB-STAGE BLIND AND BURIED VIA OPTION(BLIND AND BURIED VIA OPTION(盲盲 埋埋 孔孔 之之 選選 擇擇)D DA AC CC C E=VIA IN PAD(VIP)(導通孔在導通孔在pad裡面裡面)E Epcb板制作工艺流程介绍Conventional PCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-Imageable Dielectric(PID)FR-4Conventional PTHConventional PTHpcb板制作工艺流程介绍Conventional PCBBlind Via PCBPTH3 mil lineSVHIVHChip-on-SVHFR-4Conventional PTHConventional PTHpcb板制作工艺流程介绍
