1、Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features1Choosing The right tool for your processVersion 2(Oct,2001)Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCa
2、pillary features2Presentation Topics4Capillary design considerations4 General geometry4 Bonding cycle steps4 The capillary and the ball bonding process4 Basic TerminologyCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features3F
3、actors affecting capillary design Package typeDesignConsiderationsBonder TypePad PitchLoop HeightPad Open1st bond targetWire DiameterCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features4Basic TerminologyPad Size1st bond diam
4、eterPad spacingPad pitchCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features5General Dimensions Play-5Capillary ParametersFA Face AngleOR Outer RadiusH HoleCD Chamfer DiameterT Tip DiameterICA Inner Chamfer AngleOD Outer Dia
5、meterCA Cone AngleL LengthBTNK H Bottleneck HeightBTNK A Bottleneck AngleCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features6Wire Bonding CycleFree air ball is captured in the chamferCapillary rises to loop height positionL
6、oop formation1st bond formationHeat2nd bond formationHeatFree Air Ball formationCreation of the tail lengthDisconnection of the tailCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features7The Capillary and the ball Bonding Proc
7、essFirst Bond CD,Hole,IC AngleSecond Bond Tip,FA,ORLooping Hole,IC Type,IC Angle7Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features8Presentation Subjects4 Chamfer diameter(CD)4 Face Angle(FA)4 Outer Radius(OR)4 Cone Angle(
8、CA)4 Tip diameter(T)4 Bottleneck Height(BTNK H)4 Bottleneck Radius(BTNK R)4 Length(l)4 Inner Chamfer Angle(IC A)4 Hole(H)Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features9Tip size Vs PitchPitch m m010020030040050060002468
9、1012TipPitchSTDFPUFP mils3.97.811.815.719.723.6Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features10Tip Diameter and Cone Angle selectionCone AngleTip Diameter306.5 mil208.0 mil Pad PitchCone AngleTip Diameter308.0 mil208.0
10、 mil Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features11First Bond -1st bond formation affected by:Tip,CD&IC Volume V FAB=Vsquash+VCD+Vneck V FAB Squash CD NeckCap Design ConsiderationsK&S Bonding ToolsCapillary Definitio
11、nApplication DemandsCap design Vs Bonding ProcessCapillary features1290 Vs 120 Angle comparison IC Volume affects on different applicationsIC Volume is a function of:CD,H and ICAIC Angle selection1209000Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bo
12、nding ProcessCapillary features13Effect of Inner Chamfer Angle-900 vs.1200 First Bond -IC AngleWire Diameter:1 milChamfer Diameter:2.5 milF.A.B:2.7 milBall Height:0.7 milIC Angle=9003.5 milIC Angle=12003.8 milCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design
13、 Vs Bonding ProcessCapillary features14Ball Height Vs.Shear StrengthApparent AreanShear strength for unit area:-Shear Strength -Contact AreanContact Area is affected by ball-flatness or ball height-Flatter ball has larger contact areaShear strengthContact AreaCap Design ConsiderationsK&S Bonding Too
14、lsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features15Hole diameter selectionHole selection for STD&BTNK CapsWire Clearance=Hole Diameter-Wire DiameterPitch rangeAverage wireRec Hole Min Rec Holeumdiameter milsmilsmils2.003.002.201.502.201.701.301.801.501.201.701.
15、401.001.501.30100 and above70 to 100Capillary design.Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features16Hole selection for FP&UFP CapsWire Clearance=Hole Diameter-Wire DiameterPitch RangeWire DiameterHoleCD(um)(Mil)Rec.Mi
16、n.Min60+1.001.30 1.20 1.50550.901.20 1.10 1.35500.801.10 0.95 1.20450.700.95 0.85 1.1035Contact K&S Bonding ToolsHole Diameter selectionCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features17Hole Vs Wire diameter WireHoleAbov
17、e12010080-9070605045120100806040200mPitch mSTDFAFB-FCFDFEFFFG0.81.572.363.153.944.72 milsCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features18Second Bond-Tip and FA selectionTipFAOR10 and above0to48.0 to 4.34 to8 4.3 to 2.8
18、 8 to 112.8 and lower4 to8Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features19BTNK SelectionCA:20CA:30Cone Angle3020 Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding Pr
19、ocessCapillary features20Capillary Length=0.375”0.437”Automatic M/CCapillary Length SelectionCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features21Common DesignPitch m100120Above050100150200250300350400450500550mWireHoleCDTi
20、p1st BondCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features22FP&UFP DesignPitch m020406080100120140160180Pitch um4550607080100WireHoleCDTip1st BondmCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication
21、DemandsCap design Vs Bonding ProcessCapillary features23Presentation Subjects4 Face Angle&OR Trade Off4 Inner Chamfer Angle(IC A)4 Inner Chamfer Type(IC T)4 IC PortionCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features24Loo
22、pingWhich capillary to choose for different kind of loops?Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features25Looping -IC TypeDouble ICSupports the most common Loop Shape applicationsCap Design ConsiderationsK&S Bonding To
23、olsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features26Selected valueParameterK&S 1488Wire BonderMicro-SwissCap.Vendor40472-1181-335Cap IDm50.Bonded Ball DiaC240 Temperaturemil 5Loop HT 1mil 160-180Span 1mil 5 Step down 1mil 9Loop HT 2mil 60-80Span 2mil 22 Step do
24、wn 2Looping -D/IC influenceD/IC support Standard,High and complex loopsCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features27Looping -IR TypeInner Radius ChamferUseful for Long&Low looping Loop ShapeCap Design Considerations
25、K&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features28Capillary:MS 416FC-0212-R35Loop height:100 m nominal Wires:30 m FP2Die:80 m fine pitch TQFPLooping -IR influenceaveragestd.minmaxfine pitch TQFP25751.771792.5-3TSSOP30995.1861094.8-5.2Loop Height
26、 mWire Diameter mPackage TypeWire Span mmAverageCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features29FA and OR Trade-offEffective FaceEffective FaceCrossSectionCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionA
27、pplication DemandsCap design Vs Bonding ProcessCapillary features30 Second Bond ComparisonCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features31 Second Bond ComparisonForce:12USG:40.5Avg.Pull 7.32Force:12USG:40Avg.Pull 6.85F
28、A=15FA=11FA=4Force:10USG:80Avg.Pull 7.45FA Comparison test on 60 m BGA Platform Power:M AmpForce:gr.Pull:gr.Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features32WDIC Definition2HoleCDICTipCDFAORWDHICApplicationMin IC Recomm
29、endedSTDBTNKFPUFP0.3 mil 0.2 mil 0.15 mil 0.12 mil Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features33 Tip effect on 2nd bond1.9OR:0.3LargerTip DiameterLarger 2ndBondLargerSurface Area(Improved Stitch Pull)Cap Design Cons
30、iderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features34Presentation Subjects4 Material4 Special Designs4 Packaging and CodingCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapil
31、lary features35Capillary FeaturesIRMaterialSIGMAFlickerTBRHDHWTip FinishPackagingWear ResistLengthSpecialCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features36Bulk Density(gr/cm3):3.95-3.97Vickers Hardness(KgF/mm2):1900-2000
32、Avg.grain size(um):1.1-1.5Bulk Density(gr/cm3):4.06Vickers Hardness(KgF/mm2):1900-2200Avg.grain size(um):1.0Toughened Alumina*Standard Alumina*TA was introduced to the market by Micro-Swiss in 1995Capillary MaterialCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap
33、design Vs Bonding ProcessCapillary features37Surface EffectsMatte Finish Vs.PolishPolished capillaryMatte finished capillaryCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features38Wear resist CapillariesHard Lead Frame Bonding
34、 Under normal bonding conditions the capillary material does not wear out In many cases,bonding on Palladium Lead Frame causes a capillary material wear,and short service lifeThe Coated surface treatment CapillaryRegularCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication Demand
35、sCap design Vs Bonding ProcessCapillary features39TBR-Tail Bond ReinforceFor contamination&short tails solutionCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features40HD CapillaryDeep Access capillary:For those cases where the
36、 2nd bond should be located very close to the package wall.HDia(D)Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features41Side Cut&Double Side Cut-HWDeep Access capillary:For those cases where the 2nd bond should be located ve
37、ry close to the package wall.Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features42Flicker CapillaryFor high frequency and low-temperature bonding processAdvantages:Strong 2nd bond stitch pull Wider process window Lower bond
38、ing temperature 50%shorter bonding timeCap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features43 CapillaryFor 70 m bond pad pitch or lowerAdvantages:A complete system solution)USG/transducer/Capillary)Better on-pad performance.
39、Up to a 3 m reduction in 1st bond diameter.Up to 0.5 m reduction in 1st bond diameter Standard Deviation.Higher shear-up to a 25%increase in shear results.Efficient energy transfer-up to a 50%reduction in power applied.Increase molding process yield using thick wires.Patent Pending.Cap Design ConsiderationsK&S Bonding ToolsCapillary DefinitionApplication DemandsCap design Vs Bonding ProcessCapillary features44Special packaging and codingCork color codedfor easy identificationA space-saving 50-unit packageColor coded capillaries
