1、2u Material Introductionu Design ruleu Standard Process Flowu Open Discussion3 1.軟板基材薄膜種類軟板基材薄膜種類 聚脂樹脂(Polyester,PET)-尺寸熱安定性不如 PI Aramid纖維布-高吸水性，單價及使用性並不理想 強化型介電材料 撓曲性較差且供應者與使用者不多 氟素樹脂膜-無法在高溫下維持尺寸的穩定 聚亞醯胺樹脂聚亞醯胺樹脂(Polymide,PI)- 熱聚合後仍保一定柔軟與彈性，同時在很寬的操作範圍下有不 錯電氣特性故最常使用。4 2.聚亞醯胺基材種類聚亞醯胺基材種類 依軟板結構分為兩大類 1.
2、有接著劑三層軟板基材(3L FCCL) 2.無接著劑二層軟板基材(2L FCCL) 兩者分屬不同製造過程，製造方式與材料特性不同。3L應用在大宗軟板產品， 2L用在較高階軟板製作上，例：軟硬複合板、COF。以單面板為例COPPERPI銅箔基板(FCCL)COPPERAdhesivePI銅箔基板(FCCL) 2L-FCCL 3L-FCCL5 2-1.聚亞醯胺薄膜簡介聚亞醯胺薄膜簡介 聚亞醯胺薄膜(Polyimide,簡稱 PI)，外觀呈黃棕色，是由芳香族的雙酐類 及雙胺類合成聚亞醯胺酸高分子(簡稱PAA)，之後經高溫熱化脫水形成。 2-2.品目型號說明品目型號說明 各家標示項目不盡相同， 以台虹
3、3L-FCCL為例： 63.2L-FCCL製造方式與比較製造方式與比較Production MethodCross-Section塗佈法塗佈法(Casting)濺鍍法濺鍍法(Sputtering)壓合法壓合法(Lamination)Chill rollPI filmTargetVaccumChamberPAAHeaterPAAHeaterCopper foilPlating CuSputter metalPI filmCopper foilPAACopper foilTPIPI film73.2L-FCCL製造方式與比較製造方式與比較方法方法塗佈法塗佈法(Casting)濺鍍法濺鍍法(Sput
4、tering)壓合法壓合法(Laminate)銅箔選擇性銅箔選擇性ED,RA限EDED,RA銅箔厚度銅箔厚度薄銅(9um)有良率問題可自由控制厚度薄銅(2FlexsR=12x max. (T)3plated FlexR=20 x max. (T)The information referance to the MIL-P-50884C documentFlex Length=(2 x S)+ ( R ) (F)Flex Thickness(S)Squeeze out(R)Bending radiusFor example:1.Flex layers=2 layers2.Flex total t
5、hickness = 0.10mm3.Squeeze out=max. 1.0mmR=6 x max(T)=6 x 0.10mm = 0.6mmFL=(2 x S)+( R ) =(2 x 1)+(3.14 x 0.6)=3.884 Minimum flex length required for a 180 degree bend is 3.884mm min.Flex LayerFlex thicknessSqueeze outFlex Length(unit:mm)1-2Flexs 0.113.8842Flexs0.116.968plated Flex0.1112.28Mechanica
6、l design for bending criteria: Radius & Flex lengthDesign Rule27u Material Introductionu Design ruleu Standard Process Flowu Open Discussion28TYPE 1 PROCESS (Standard)(For Flex Without Edge Finger or SMT Pads)UnimicronUnimicronRigidFlexS/M25L1Cu Foil+PlatingH oz+plating35NF P/PNPLR1551 LWMF 1080(63%
7、)70L2Cu Foil+PlatingH oz+plating25NF P/PNPLR1551 LWMF 1080(63%)70L3Cu Foil+PlatingH oz+plating25NF P/PNPLR1551 LWMF 1080(63%)60CVL-PIPI 0.5mil12.5CVL-AdAd 25um15L4-FCu Foil1/3 oz+plating1/3oz2525FCCL PIThin-Flex A1003ED25um2525L5-FCu Foil1/3 oz+plating1/3oz2525CVL-AdAd 25um15CVL-PIPI 0.5mil12.5NF P/
8、PNPLR1551 LWMF 1080(63%)60L6Cu Foil+PlatingH oz+plating25NF P/PNPLR1551 LWMF 1080(63%)70L7Cu Foil+PlatingH oz+plating25NF P/PNPLR1551 LWMF 1080(63%)70L8Cu Foil+PlatingH oz+plating35S/M25695.00130.006957575TOL.(+)TOL.(-)Spec(mm)Estimate thk (um)Taiflex FHK 0525Taiflex FHK 0525Customer Requirement Nor
9、mal Tg. (145C) Halogen Free Material31(L45)Flex Material Wait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL- CuttingMechanical Drilling(I)Inner Layer (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Oxide Treatment P.T.H
10、& Copper PlatingLaminate CuttingSub processMain process32L36 Plus I ProcessConformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Ply-Up Of LayerLamination L45-coreBlind & Copper PlatingLaser DrillingBlaser AOIInner Layer (image transfer) DES Line (develop
11、, etch, strip) AOI (automatic optical inspection) Oxide Treatment Wait for Build up to L27Non flow Prepreg Material Prepreg Routing Sub processMain process33L27 Plus II ProcessConformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Ply-Up Of LayerLamination
12、 L36-coreBlind & Copper PlatingLaser DrillingBlaser AOIInner Layer (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Wait for Build up to L18Non flow Prepreg Material Prepreg Routing Oxide Treatment Sub processMain process34L18Plus III ProcessLay UpLamination L27-co
13、reConformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) P.T.H & Copper PlatingMechanical Drilling(I)Laser DrillingBlaser AOIOuter Layer (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Solder MaskImmersion GoldRouting Ha
14、rd Die PunchingO/S TestingOQCPacking &ShippingNon flow Prepreg Material Prepreg Routing Sub processMain processTYPE 2 PROCESS (PMF Protect Process)(For Flex With Edge Finger or SMT Pads)36UnimicronUnimicron37(L34)Flex Material Tooling DrillLaminate CuttingInner Layer L3/L4 (image transfer) DES Line
15、(develop, etch, strip) AOI (automatic optical inspection) Wait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL- CuttingPumiceStiffener Material Stiffener ShearingLamination(Flex core with stiffener)PMF Material PMF ShearingLamination(Flex core with PMF)Bakin
16、gLaminationFlex core with PMFSub processMain processPlasma Brown Oxide38Build Up L2-L5(Plus I)Wait for Build up to L1/L6PP CuttingLamination(with flex core)Blaser AOIMechanical Drill(L2-L5)Plug viaburied via L2-L5)ScrubbingInner Layer L2/L5 (image transfer)AOI (automatic optical inspection)Conformal
17、 Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Laser Drilling(L2-L3/L4-L5)P.T.H & Copper PlatingDES Line (develop, etch, strip)Sub processMain process39L1-L6 ProcessLay upLamination Conformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automa
18、tic optical inspection) L25-build up ICopper Reduction(by chemical)Electro-plating(filled via)Laser Drilling(L1-L2/L5-L6)Blaser AOIMechanical Drill P.T.H & Copper PlatingOuter Layer L1/L6 (image transfer)DES Line (develop, etch, strip)AOI (automatic optical inspection)Routing-2O/S Testing OQCPacking
19、 &ShippingSolder MaskImmersion GoldRouting-1Remove rigid waste area above flex areaPSF Lamination(cover rigid area)Plating hard gold(finger on flex)Remove PSF Flex PunchPP routingSub processMain processLASER CUTTINGDIAGRAM41Step 1Transition LineTransition LineStep 2Step 3Laser stop (target) copper d
20、esign in L2/51. Laser Drill from top to L2 & bottom to L52. Etch away target copper in L2&51. Remove FR4 cap above Flex along with laser cutting pathTYPE 3 PROCESS (FR4 Protect Process)(For Flex With Edge Finger or SMT Pads)4344(L34)Flex Material Mechanical Drilling(I)P.T.H & Copper PlatingLaminate
21、CuttingInner Layer & DES (image transfer)AOI (automatic optical inspection)Oxide TreatmentWait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL- DrillingLaminationFlex core with CVLCVL- PunchSub processMain processSub processMain process45Rigid Inner Core Pro
22、cessWait for Build up to L25Bonding Sheet Material BS DrillingCore drillingLaminate CuttingInner Layer & DES (image transfer)AOI (automatic optical inspection)CORE-CuttingSoft Bonding(Core with BS) BS - PunchSub processMain processBonding Sheet (BS)Inner core (one side copper)46L25 ProcessLamination
23、(Flex with Rigid )Micron viaCopper PlatingInner Layer & DES (image transfer)(L2/L5) AOIOxide TreatmentWait for Build up to L16Rigid Rigid FlexConformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Laser Drilling(L2-L3/L4-L5)Rigid core Laminate with Flex co
24、re(PRESS)Sub processMain process47L16 ProcessLay upLamination Laser Drilling L25-coreP.T.H & Copper PlatingDrilling Outer Layer & DES (Image transfer)(L1/L6)AOISolder maskRemove FR4 Above FlexImmersion Ni/Au Printing of Legend CNC Routing (2 )O/S TestingFinal PunchBlaser AOIOQCPacking &ShippingConfo
25、rmal Mask (Image transfer) DES Line (develop, etch, strip) AOI (Automatic optical inspection) Sub processMain processCNC Routing (1)48Thank you49Reference50L TypeU TypeZ Type Measure Method:1. Pretreatment: Reflow 2 cycles2. According customers condition to test 3. Static: above 30cycles， Dynamic: U
26、ntil fail. Criteria: Resistance change rate 10%Reliability on flex: Bending test51ABABAB BABAB Measure Method:1. Pretreatment: Reflow 2 cycles2. According customers condition to test 3. Static: above 30cycles， Dynamic: Until fail. Criteria: Resistance change rate 10%Reliability on flex: Sliding Test52 Measure Method:1. Pretreatment: Reflow 2 cycles2. Criteria: Resistance change rate 10%Reliability on flex: Torsion test53 Measure Method:1. Pretreatment: Reflow 2 cycles2. Criteria: Resistance change rate 10%Reliability on flex: G/F crack Test
