1、电子构装层级区分示意。电子构装层级区分示意。的发展史的发展史的发展史的发展史Black Oxide(Oxide Replacement)黑氧化(棕化）Laying-up/Pressing排板/压板Inner Dry Film内层干菲林Inner Etching(DES)内层蚀刻Inner Board Cutting内层开料AOI自动光学检测Solder Mask湿绿油Middle Inspection中检PTH/Panel Plating沉铜/板电Dry Film干菲林Drilling钻孔Pattern Plating/Etching图电/蚀刻Packing包装FA最后稽查Hot AirLev
2、elling喷锡Profiling外形加工Component Mark白字FQC最后品质控制内层洗板Clean内层制作去毛边debur(2)49“41“10.25“16.33“1张大料张大料12块板料块板料Prepreg铜箔类型：铜箔类型：1/41/4OZOZ；1/3OZ1/3OZ；1/2OZ1/2OZ；1OZ1OZ；2OZ2OZ；3OZ3OZP P片类型：片类型：106106、21162116、10801080、76287628、21132113等等Copper FoilChemical Clean化学清洗DES显影/蚀板Exposure曝光Black Oxide黑氧化Laying-Up排板
3、Pressing压板Resists Lamination辘干膜Oxide Oxide ReplacementReplacement棕化棕化 AOI自动光学检测PE Punching 啤孔 聚乙烯保护膜聚乙烯保护膜干膜干膜曝光前干膜的分子结构为链状结构，可溶于曝光前干膜的分子结构为链状结构，可溶于1%1%的的NaNa2 2COCO3 3 溶液。溶液。曝光后干膜的分子结构为立体网状结构，不溶于曝光后干膜的分子结构为立体网状结构，不溶于1%1%NaNa2 2COCO3 3溶液。溶液。未曝光的感光膜未曝光的感光膜 可溶解可溶解已曝光的感光膜已曝光的感光膜不可溶解不可溶解辘干膜曝光显影停放停放1515分
4、钟分钟停放停放1515分钟分钟Take 4 layer for ExampleTake 4 layer for ExampleCopper FoilCopper FoilLaminateLaminateLayer 1Layer 1Layer 2Layer 2Layer 3Layer 3Layer 4Layer 4Pre-pregPre-preg上热压模板上热压模板上定位模板上定位模板叠层叠层定位销钉定位销钉下定位模板下定位模板下热压模板下热压模板牛皮纸缓冲层牛皮纸缓冲层多层板压合的全过程包括预压、全压和保压冷却三个阶段多层板压合的全过程包括预压、全压和保压冷却三个阶段PIN LAM PIN L
5、AM L表示批量板（S表示样板)板的层数（1表示单面板，2表示双面板3,4,5,6,7,8,）落单的顺序号版本号(A0,B0,C0,A1,B1,C1)L 4 R 0001 A1生产型号举例：表示工艺（R表无铅喷锡，H表有铅喷锡，C 表示沉金板Guide HoleGuide Hole管位孔管位孔BackBack Up Board Up Board垫板垫板PCBPCB EntryEntry盖板盖板 钻孔板的剖面图钻孔板的剖面图孔钻孔定位孔板料铝 质量缺陷质量缺陷钻孔缺陷：偏孔、多孔、漏孔、孔径错、断钻头、塞孔、未钻透钻孔缺陷：偏孔、多孔、漏孔、孔径错、断钻头、塞孔、未钻透孔内缺陷孔内缺陷铜箔缺陷：
6、分层、钉头：钻污、毛刺、碎屑、粗糙铜箔缺陷：分层、钉头：钻污、毛刺、碎屑、粗糙基材缺陷：分层、空洞、碎屑堆、钻污、松散纤维、沟槽、来福线基材缺陷：分层、空洞、碎屑堆、钻污、松散纤维、沟槽、来福线 PTH/孔内沉铜PTH/孔内沉铜Panel Plating/板面电镀板料沉铜沉铜/板面电镀剖面图板面电镀剖面图Panel Plating板面电镀Scrubbing 磨板Rinsing三级水洗Desmear除胶渣Rinsing三级水洗Puffing膨胀Neutralize中和Rinsing二级水洗Degrease除油Load Panel 上板Rinsing三级水洗Rinsing二级水洗Catalyst活
7、化Pre-dip预浸Rinsing二级水洗PTH沉铜Micro-etch微蚀Base copperBase copper底铜底铜PTHPTH沉铜沉铜Rinsing二级水洗Un-load Panel下板Panel Plating板面电镀PTH 孔内沉铜PTH 孔内沉铜Panel Plating板面电镀Prepreg板料Cutaway of Panel Plating and PTH沉铜沉铜/板面电镀剖面图板面电镀剖面图Scrubbing 磨板Developing显影Exposure曝光Laminate Dry Film辘干菲林Duplicate GII Dry Film 黄菲林复制After D
8、eveloping 显影后Load Panel 上板Acid Dip酸浸Rinsing水洗Micro-etch微蚀Rinsing水洗Copper Electroplate电镀铜Rinsing水洗Acid degreaging酸性除油Rinsing水洗Acid Dip 酸浸Tin electroplate电镀锡plate nickel/gold电镍Un-load下板Plate gold 电金Rinsing水洗Rinsing水洗After Pattern PlatingAfter Pattern Plating图电后（锡板）图电后（锡板）Striping 褪膜Etching蚀刻Tin Stripi
9、ng褪锡常采用金、铅锡、锡、等金属及油墨、干膜作抗蚀层。常采用金、铅锡、锡、等金属及油墨、干膜作抗蚀层。After Etching蚀刻后（锡板）蚀刻后（锡板）Pre-Baking 预固化 Duplicate GII Film 复制黄菲林Pretreatment前处理Screen Printing丝印Exposure 曝光Developing 显影停放停放1515分钟分钟停放停放1515分钟分钟Baking 终固化W/FW/F曝光菲林曝光菲林喷锡前处理前处理预涂助焊剂预涂助焊剂热风整平热风整平清洗清洗Solder Mask/绿油Annual Ring 锡圈V-Cut/V坑Component Ma
10、rks 白字PAD/焊锡盘Production Number 生产型号3C6013C6013C6013P20116A0Golden Finger金手指 Pressing压板Drilling 钻孔 PTH/PP沉铜/板电Dry Film干菲林Exposure 曝光Pattern Plating图电Developing 冲板Plating Tin镀锡Strip Film/Etching 褪膜蚀刻菲林Strip Tin 褪锡Wet Film 湿绿油HAL 喷锡电子产品发展趋势电子产品发展趋势Technology Roadmap 2002+20022002 20012001 20032003Q4Q1Q
11、2Q3 Q3 Q4 Q1 Q2Q3OTHERS OTHERS MULTILAYERMULTILAYERMICRO VIASMICRO VIASFree HalogenMatl(ZS)HorizontalImmersion Tin(ZS)BuriedCapacitance(GZ)Matl:Getek(GZ)Back Panel(GZ)Laser Drill(GZ)HDI(GZ)High LayerCount(24L)(GZ)Matl Nelco(GZ)RogersAluminumHeatsinks(ZS)NOVIP(ZS)Deep Tank Gold(GZ)Teflon(GZ)High Laye
12、rCount(48L)(GZ)High LayerCount(36L)(GZ)Cyanate Ester(GZ)电子产品电子产品发展趋势发展趋势Low Loss MaterialLow Loss MaterialLow Loss MaterialLow Loss MaterialLow Loss Material与与FR-4板料比较板料比较0.0050.0100.0150.0200.025Gore SpeedboardDf 1 MHzDk 1MHz4.03.02.05.0BTPolyimideN4000-13Teflon/GlassHigh Tg EpoxyEpoxy ThermountImproved Speed Signal Integrity RegionStd.Epoxy N6000N4000-13SI N6000 SIGetekN4000-6 SIN4000-7 SISI=Signal Intergrity Low Dk GlassN4000-6 N4000-7N4000-2Roger 4350Low Loss MaterialTeflon（PTFE)板料板料Teflon（PTFE)板料板料Teflon（PTFE)板料板料Halogen-free MaterialHDIHDIPCB PCB 发展趋势发展趋势
