1、Chip Manufacturing Overview 芯片制作概述晶柱晶柱Silicon Ingot晶圆晶圆Wafer光罩制作光罩制作/光刻光刻离子植入离子植入切割、封装切割、封装电镀电镀(Die,晶粒)(Chip,晶芯)蚀刻蚀刻Mask Making/ PhotolithographyIon ImplantationAssembly&TestingElectroplatingEtching沉积沉积Deposition To make wafers, polycrystalline silicon is melted. The melted silicon is used to grow s
2、ilicon crystals (or ingots) that are sliced into wafers.首先融化多晶硅，生成晶柱，然后切割成晶圆。Raw Material for Wafers 晶圆制作所需原料To remove the tiniest scratches and impurities, one side of each wafer is polished to a mirror-like surface. Chips are built on this surface.切下的晶圆要经过清洁、磨光等步骤以去除杂质，使平面光滑。Raw Material for Wafer
3、s (Contd)晶圆制作所需原料 (接上页)A layer of silicon dioxide (SiO2) glass is grown on the wafer by exposing the wafer to oxygen at very high temperatures. A process called chemical vapor deposition (CVD) is then used to coat silicon dioxide onto the wafer surface. Because it will not conduct electricity, this
4、layer is called “dielectric”. Later, channels will be etched or otherwise formed in the dielectric for conducting materials. SiO2 may also be grown or deposited during later steps in the process as layers of the circuit are built onto the chips:制作晶片的第一步是在晶圆上沉积一层不导电的二氧化硅。在晶片的后续制作过程中，二氧化硅层的成长、沉积会进行很多次
5、。在高温下使晶圆曝氧可以使二氧化硅层成长。然后使用化学气相沉积方法使二氧化硅层沉积在晶圆表面。Chip Manufacturing Process Deposition 芯片制作过程 沉积 SMICWhat is microlithography?Microlithography: transfer the pattern of circuitry from a mask to a wafer.Photolithography, or lithography for short, is used to create multiple layers of circuit patterns on
6、a chip. First, the wafer is coated with a light-sensitive chemical called photoresist. Then light is shone through a patterned plate called a mask or reticle to expose the resistmuch the same way film is exposed to light to form a photographic image.下面使用光刻制程在芯片建立多层电路图案。首先，晶圆表面上覆盖上一层感光性强的化学制品光刻胶。象光透过
7、电影底片形成图象一样，光透过光掩膜在晶圆上形成图案。Chip Manufacturing Process Photolithography 芯片制作过程 光刻SMICThe wafers exposure to light in lithography causes portions of the resist to “harden” (or become resistant to certain chemicals). The “non-hardened” resist is washed away. Then the material below it, for example SiO2,
8、 is etched away. Finally, the “hardened” resist is stripped off so that the material underneath forms a three-dimensional pattern on the wafer. The first lithography and etch process will result in a pattern of SiO2.光刻制程后，感光部分的光刻胶具有强的抗腐蚀性，抗腐蚀性弱的光刻胶在接下来的制程里被洗去。接着光刻胶下面的部分被蚀刻制程除去。最后，抗腐蚀性强的光刻胶也被剥离。光刻与蚀刻
9、制程在晶圆表面形成3D的图案。Chip Manufacturing Process Etching 芯片制作过程 蚀刻SMICThrough several lithography and etch steps, subsequent layers of various patterned materials are built up on the wafer to form multiple layers of circuit patterns on a single chip.经过几次光刻与蚀刻步骤，在晶圆表面叠加成多层不同图案Chip Manufacturing Process Form
10、ing Multiple Layers芯片制作过程 生成多层SMICTo control the flow of electricity through a chip, certainareas of the wafer are exposed to chemicals that changeits ability to conduct electricity. Atoms from the chemicals,called doping materials, can be “diffused, ” or forced, into areas of the silicon wafer thro
11、ugh chemical exposure and heating. 为了能在晶片上控制电流，加热晶圆，使晶圆部分区域接触添加剂。添加剂里的原子能够替换晶圆里的部分硅原子来改变其导电性。Chip Manufacturing Process Ion Implantation 芯片制作过程 离子植入SMIC The portions of a chip that conduct electricity form the chips interconnections. A conducting metal (usually a form of aluminum) is deposited on th
12、e entire wafer surface. Unwanted metal removed during lithography and etching leaves microscopically thin lines of metal interconnects. All the millions of individual conductive pathways must be connected in order for the chip to function. This includes vertical interconnections between the layers a
13、s well as horizontal Interconnections across each layer of the chip.进行电连接。导电金属（通常是铝）在晶圆表面沉积。使用光刻和蚀刻制程去除没有用的金属。现在复杂的晶片都需要很多层绝缘体。一个正常运作的晶片需要连接数以百万计的传导线路，包括层上水平连接和各层之间的垂直连接。Chip Manufacturing Process Electroplating 芯片制作过程 电路连接SMICSMIC 0.13u Cu BEOL Flow1ML DD FLOWPOST-SLR CLEANTaN/Ta & Cu SEEDCU PLATIN
14、GM2 CU CMPMTOX PHOTOMT DRY ETCHMT CLEANSTOP LAYER REMOVEVIA DRY ETCHVIA CLEANBARC COATINGPLUG ETCH BACKCVD SIN DEPFSG DEPSION DEPVIA PHOTOSMIC is currently running 1P6M, 1P8M processEach chip on a completed wafer is tested for electrical performance. Any chips that fail are marked so they can be dis
15、carded when sawed into individual dies. The chips are put into individual packages which will protect the chips and provide connections from the chips to the products for which they are designed. For example, chips destined for computers are placed In packaging that can be plugged into computer circ
16、uit boards. Once packaged, chips are tested again to make sure they function properly before being shipped to distributors or placed in electronic products.晶圆上的每一个晶粒都需要进行测试。有缺陷的晶粒被标记起来，在进行晶圆切割时这些晶粒被剔除。每个晶粒都按要实现功能的不同进行单独封装。比如要应用在电脑上的晶粒被封装后能够插入电脑集成电路板。封装好后，在进行最终使用前，晶粒将进行再一次测试以确保功能正常。Chip Manufacturing
17、 Process Assembly&Testing 芯片制作过程 切割、封装SMICPackage Types and Applications (1)Conventional Leadframe Type (PDIP, SOP, TSOP, QFP)Advanced Substrate Type (BGA)Molding compoundLeadframeGold wireDieEpoxy (Silver paste)Die attach padMolding compoundEpoxy (Silver paste)DieGold wireSolder ballBT resinThrough
18、 holeDieGold wireLOC tape Leadframe with Down-set LOC (Lead-on-chip)晶柱晶柱Silicon Ingot晶圆晶圆Wafer离子植入切割、封装电镀(Die,晶粒)(Chip,晶芯)蚀刻沉积Ion ImplantationAssembly&TestingElectroplatingEtchingDeposition SMIC Business应用领域Applications 应用领域应用领域光罩制作/光刻Mask Making / Photolithography中芯业务中芯业务Chip Manufacturing Process Summary 芯片制作过程总结Thanks 谢谢谢谢Q & A 请您提问请您提问
