1、6,000,008,00M.Chbat,S.Eberlin,M.Tochtermann,T.JuhnkehiT 7500 Multi-Haul DWDM system Product Reliability Update Processes,Status,and MeasuresSept 15,2019Information and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components:EDFA VOA GTC PassivesNegotiations with supp
2、liers:Modeling Field experience Supplier comparisonElectrical Components:Resistors Capacitors Transistors ICs etc.Standards:SN 29500 IEC 61709Mechanical Components:Connectors Boards etc.Standards:SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communication Networks6,0
3、00,008,00Product Reliability Assurance ProcessReference:Siemens standard;in agreement with international standards IEC 61709product definitionproduct developmentproduct deliveredrequirements aligned with technology basis failure rate allocation to individual cards involvement of component engineerin
4、g&QAcard failure rates on basis of parts listscomponent rating by designnew&critical components specificationnew components&supplier auditsin production failure controlfield return analysis&threshold monitoringconservative data based on predicted valuesregular component supplier auditsInformation an
5、d Communication Networks6,000,008,00Reliability Control and ImprovementCross-functional team established to install focused program Close interaction with the supplier for design,technology and processEarly failure monitoring and feedback in development phase Extended testing including temperature c
6、ycling in productionDetailed failure monitoring in production for early corrective actionInformation and Communication Networks6,000,008,00Predicted FIT rates vs.field return FIT ratesField return FIT rate inherently is(!)lower than predicted FIT rate nspare parts dont contribute to FMAnnon-installe
7、d equipment at certain carriersnlow channel count for many yearsntemperature for FIT estimation probably higher than in realitynmargin(e.g.,due to low channel count,low PMD,BOL)can mask performance degradationInformation and Communication Networks6,000,008,00Functional Partition of OLIOptical amplif
8、ication via EDFA gain blocknPump diodesnMonitor diodesnEDF-HeaternInternal Gain SwitchOSC splitting functions asnAdd/Drop of the OSC channel using wavelength selective couplersnSplitting of monitor signals at the input and output port and at intermediate measurement pointsSpectral shaping of the sig
9、nal using anVOA for setting the EDFA to an optimized operating pointnGTC for tilt compensationOptical monitor ports at input and output for signal supervisionAPSD circuitryGain Control and Supervision(DSP,on-board processor)Electrical components for control and power supplyMechanics including PCBInf
10、ormation and Communication Networks6,000,008,000 1 2 3 4 5 6 7 8 9 10 11 12 13 Operating time T in yearsFailure rate l l Early failuresl l totalWear-out failureThe bathtub curve:Failure rates l l via time TRandom failureFor the field replaceable HW-units and their componentsthe failure rate l l coul
11、d be only predicted by random failures!The unit of the failure rate l l is a FIT(Failure in Time;1 FIT=1 Failure per 109h)!Bathtub CurveInformation and Communication Networks6,000,008,00IEC 61709:Electronic components ReliabilityReference conditions for failure rates and stress models for conversion
12、(no basic failure rates)Relationship between StandardsSIEMENS standard SN29500/IEC 61709 compared to SR-332SR-332:Reliability Prediction Procedure forElectronic EquipmentSN29500:Failure rates of componentsExpected values(This is in addition to IEC 61709)a)Climatic and mechanical stresses per IEC 721
13、-3-3(see next slide)multiplying factors for environmentalconditionsb)Quality factortested components SN725004 quality levels knownc)Temperature and electrical stressby reference conditions IEC 61709given reference conditions and conversion(SR-332)Information and Communication Networks6,000,008,00IEC
14、 61709:Electronic components Reliability Reference conditions for failure rates and stress models for conversionThe failure rate under operating conditions is calculated as follows:TIUfRe l l l lWherel lref is the failure rate under reference conditions;U is the voltage dependence factor;I is the cu
15、rrent dependence factor;T is the temperature dependence factor.These Parameter are listed e.g in the SN29000 library!Reference conditions for climatic and mechanical stressesType of stressReference condition 1)q qamb,ref=40 CClimatic conditionsClass 3K3 as per IEC 721-3-3Mechanical stressClass 3M3 a
16、s per IEC 721-3-3Special stresses 3)NoneFor details of notes(-1,-2,-3)please refer to IEC 61709Ambient temperature 2)The definitions,reference conditions and conversion models used in the IEC 61709 fullycorrespond with the already existing SIEMENS standard SN 29500 method.Details:SIEMENS Standard SN
17、29500 and IEC 61709Information and Communication Networks6,000,008,00FIT Rates of Individual Electrical Components(1)Voltage dependence and Current dependence UC UUeCrefC()122 UCUUUUeCrefC()()maxmax322(1)(2)UOperating voltage in VUrefReference voltage in VUmaxRated voltage in VC1Constant in(1/V)C2C2
18、,C3Constants(1).Digital CMOS Families,Contactors (2).Others ICIIIIeCrefC()()maxmax455IOperating current in AIrefReference current in AImaxRated current in AC4,C5ConstantsInformation and Communication Networks6,000,008,00FIT Rates of Individual Electrical Components(2)AConstantEa1,Ea2Activation energ
19、ies in eVTU,refReference ambient temperature in KT1Reference junction*)-(comp.*)-)temperature in KT2Actual junction*)-(comp.*)-)temperature in K*)Depends on type of component,see also SN 29500,Part 1,Capt.4.3 TEa zEazEa zEazA e+(1-A)eA e+(1-A)e121ref2refwithinin z11605(1T1T)1eVz11605(1T1T)1eVU2refU1
20、refrefandTemperature dependenceInformation and Communication Networks6,000,008,00The expected failure rate of a HW-unit can be calculatedby adding the expected failure rates of the components:l l l ljjComponentUnitEPROMCapa.Resi.FanTrans.DiodeDC/DCOptic.ModuleICPINsLEDSolder jointsASICfield-replacea
21、ble HW-unit(Example)EPROMOptic.ModulePINsLEDICICICTrans.DiodeDiodeTrans.Trans.FanCapa.Capa.Capa.Capa.Capa.Resi.Resi.Resi.Resi.Resi.Resi.Resi.ASICResistors1 FIT8168 FITCapacitors2 FIT61212 FITDiodes8 FIT3624 FITTransistors15 FIT41260 FITICs25 FIT464100 FITEPROM100 FIT264200 FITDC/DC40 FIT22880 FITASI
22、C250 FIT21016500 FITFAN150 FIT210300 FITOptical Module800 FIT2321.600 FITSolder joints0,1 FIT1260126 FIT3.010 FITFailure rates ofl l ComponentsSum offailure ratesName ofComponentsNo.ofPinsNo.ofComp.Example:tot.failure rate of the HW-unit l l unit=Component 1R1 1,l,l1Component 2R2 2,l,l2Total functio
23、nal reliability(survivor)Rtot of two components:tttt21tottot2121eeee(t)R(t)R(t)R l l l l l l l l l l Details:Total Reliability and Total Failure Rate of UnitInformation and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components:EDFA VOA GTC PassivesNegotiations with
24、 suppliers:Modelling Field experience Supplier comparisonElectrical Components:Resistors Capacitors Transistors ICs etc.Standards:SN 29500 IEC 61709Mechanical Components:Connectors Boards etc.Standards:SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communication Netwo
25、rks6,000,008,00Estimation of FIT Rates for Optical ComponentsIn parallel to the qualification cross-check detailed discussions take place with the vendorWhat is the estimate of the vendor?How did he reach his estimate?What is the FIT rate of sub-components and PCBAs of the module?Results of the cros
26、s-qualification are taken into account(failures,corrective actions,changes)The estimation of the vendor and the expertise of qualification team lead to the Siemens estimate(not necessarily the same as the vendors estimate)Field returns are taken into account when available and compared to the estima
27、teFIT rates are adapted accordingly(repetitive process)Information and Communication Networks6,000,008,00Example of FIT Rate Adaption:EDFA w/5 pumpsFirst estimate in 2019:6000 FIT (complete new design incl.new Pumps,no experience at SIEMENS side)New vendors(new spec.)were qualified by CoC Optics and
28、 the CoC process took placeEstimates by two vendors:3500-4800 FITReduction to 5000 FIT beginning of 2019Quality improvement discussions with the vendors ongoingCheck with field returns:1600 FITReduction to 4000 FIT(Siemens estimate)in April of 2019Continuously monitoredSimilar process with EDFAs(2 p
29、umps)lead to an estimate of 2400 FITInformation and Communication Networks6,000,008,00Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier(1)optical components(40C)VendorSub fit rate quantity Fit rate980nm Laser diodeSupplier A 3201320,0980nm Laser diodeSupplier A 3
30、77,61377,6980nm Laser diodeSupplier A 129,61129,61480nm Laser diodeSupplier A 70,4170,41480nm Laser diodeSupplier A 70,4170,4Photo diodeSupplier B12896,0Coupler(#)Supplier A2918,0980nm/1550nm WDM coupler(#)Supplier A236,0Isolator(#)Supplier C8,2649,2Hybrid moduleSupplier D633189,0WDMSupplier A 12,32
31、24,6Optical switchSupplier E30130,0Gain equalizing filterSupplier A 12,3336,9EDFSupplier F166,0total fit rate1423,7Information and Communication Networks6,000,008,00Example of FIT Rate Calculation for an Optical Amplifier Provided by the EDFA Supplier(2)Overall FIT rate:3457.732369921836272602120150
32、11501222460530012022401,576114752150482965784564552252034,0total fit rateelectrical components(40C)quantitySub fit ratefit rateFET SILICON LINEARCAPACITOR DISCRETE FIXED CERAMICDIODE SILICON GENERAL PLASTIC 1ACONNECTOR Multi 6PinCONNECTOR Multi 40PinINTEGRATED CIRCUITS DIGITAL 21-50TRRESISTOR FIXED
33、FILM=1MEGRESISTOR VARIABLE FILM=200KRESISTOR FIXED WIRE ACCURA=1MEGINTEGRATED CIRCUITS ANALOG 1-32TRCONNECTOR Multi 100PinTRANSISTOR SILICON NPN PLASTIC=0.6WFET SILICON SWITCHInformation and Communication Networks6,000,008,00Siemens Reliability Process OverviewOptical Components:EDFA VOA GTC Passive
34、sNegotiations with suppliers:Modelling Field experience Supplier comparisonElectrical Components:Resistors Capacitors Transistors ICs etc.Standards:SN 29500 IEC 61709Mechanical Components:Connectors Boards etc.Standards:SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and C
35、ommunication Networks6,000,008,00Reference FIT Rate for electrical and mechanical componentsSN 29500 developed by ZT SR Corporate Function Standardization and Regulation,Cross-functional expert team SN 29500,Committee QualityUsed by all Siemens divisionsUpdated by expert team with data from:field ex
36、perience,component qualifying teams and component manufacturersHistory and acceptanceDeveloped as companys internal standardFirst edition in 1978Worldwide used by the most Siemens groupsWidely used outside the companyGenerally used calculating the Siemens telecommunications systemsApproved worldwide
37、 by the customersFully in accordance with EN/IEC 61709 actually parts Part1:GeneralPart2:integrated circuitsPart3:discrete semiconductorsPart4:passive componentsPart5:electrical connectionsPart6:connectors and socketsPart7:relaysPart9:switchesPart10:signal and pilote lampsPart11:contactorsPart12:opt
38、ical semiconductors,signal receiversPart13:light-emitting and infrared diodesPart14:optocouplerInformation and Communication Networks6,000,008,00FIT Rates of Individual Electrical ComponentsExamble:OLI Mainboard(FR total summary)Total Results:FR meanMTBF mean MTBF meanfithoursyearstotal3.563280.6983
39、2,0Tu:40C mean component ambient temperatureZf:Continuous operation 8760 h per year1 fit equals one failure per 109 component hoursFailure rates for positions of the Quality-list:JunctionSN29500Mean Junction FR singleFR totalQuant.Component TypeComplexityTemp.refStress refFR refTScurcuitTemp.or Pin
40、countCfit1=refstressCfitfit6IC logic1/10g45T=140,851413,40720,46IC analog1/30t55T=1;Vuv=0,730,77148,62,32213,96IC Telecom100/1Kg55200,67Tei=54513,480,41EEPROM16Kb55T=1300,55Tei=54516,63816,61EPLD5Kg80600,29Tei=105017,68117,7278Resistor Metal film55T=10,2550,255,62NTC Termistor40T=134036,0214Capacito
41、r Ceramic X7R40T=1;Vuv=0,520,45Vue=.3400,899192,48HF Inductor55555540,010Inductor for EMC601,5601,515,012Universal Diode55155112,010Universal Transistor55T=1;Vuv=0,5555550,05PNP Transistor Array2 v55T=1;Vuv=0,5150,820,99Tei=10,Ub=155012,21161,15N-Channel MOSFET55T=1;Vuv=0,552,780,99 Nmw=1000,Ub=5801
42、3,81269,11LED45Viv=0,5214522,05Dual Optocoupler2 v55T=1150,76Tei=105022,813114,1|2Connector multible cont.Pin72 v400,05403,67,23Connector single cont.pin50 v400,5Vfi=40402060,02 Connector high electr.loaded1 v4014012,06426*)Soldering point machine400,03400,03192,8*)all the pin of quantity of compone
43、nts pin count are addedSum3.563Vuv=Voltage ratio ref.;Vue=Voltage ratio act.;Ubv=Supply Voltage ref.Ub=Supply Voltage;Viv=Current ratio;Tei=self heating Junction;Nmw=Power consumption;Vfi=Used Elements of deviceComponentReferences from SN29500/IEC 61709Typical stress per component dataor circuit dep
44、endantResultsInformation and Communication Networks6,000,008,00Reliability of Basic Booster(OLISTBNC):Contribution of Component GroupQuantityComponent GroupPercent.17Optoelectronics43%41Other Components11%550Capacitors8%64IC analogue6%7IC Memories5%45Connectors Sockets4%6IC ASIC4%26Transistors4%1087
45、Resistors3%0Electr.Connections3%2Micro-Processors and-Controllers2%4IC Telecom2%15IC Standard1%68Diodes1%6Semiconductors Power1%1938Sum100%Information and Communication Networks6,000,008,00Reliability of Standard Booster(OLITBNC):Contribution of Component GroupQuantityComponent GroupPercent.34Optoel
46、ectronics52%46Other Components9%828Capacitors7%104IC analogue6%63Transistors5%1791Resistors3%7IC Memories3%0Electrical Connections3%67Connectors Sockets3%6IC ASIC3%8IC Telecom2%126Diodes2%2Micro-Processors and-Controllers1%19IC Standard1%9Semiconductors Power1%3110Sum100%Information and Communicatio
47、n Networks6,000,008,00Siemens Reliability Process OverviewOptical Components:EDFA VOA GTC PassivesNegotiations with suppliers:Modelling Field experience Supplier comparisonElectrical Components:Resistors Capacitors Transistors ICs etc.Standards:SN 29500 IEC 61709Mechanical Components:Connectors Boar
48、ds etc.Standards:SN 29500 IEC 61709Card FIT Rate Feedback from Field Return RateInformation and Communication Networks6,000,008,00FIT Rates of Individual Mechanical ComponentsExamble:OLI Mainboard(FR total summary)Total Results:FR meanMTBF mean MTBF meanfithoursyearstotal3.563280.69832,0Tu:40C mean
49、component ambient temperatureZf:Continuous operation 8760 h per year1 fit equals one failure per 109 component hoursFailure rates for positions of the Quality-list:JunctionSN29500Mean Junction FR singleFR totalQuant.Component TypeComplexityTemp.refStress refFR refTScurcuitTemp.or Pin countCfit1=refs
50、tressCfitfit6IC logic1/10g45T=140,851413,40720,46IC analog1/30t55T=1;Vuv=0,730,77148,62,32213,96IC Telecom100/1Kg55200,67Tei=54513,480,41EEPROM16Kb55T=1300,55Tei=54516,63816,61EPLD5Kg80600,29Tei=105017,68117,7278Resistor Metal film55T=10,2550,255,62NTC Termistor40T=134036,0214Capacitor Ceramic X7R40
