1、生产力促进组Created By:luckfang1SMT Training Material 生产力促进组Created By:luckfang2nWHATS SMT?n常用术语常用术语n电子元件知识电子元件知识n工艺流程介绍工艺流程介绍n 焊锡膏基础知识焊锡膏基础知识 助焊剂介质助焊剂介质(Flux medium)金属颗粒金属颗粒n 印刷印刷 n 回流温度曲线回流温度曲线n 故障分析故障分析n 使用注意事项使用注意事项生产力促进组Created By:luckfang3WHATS S.M.T?nWhats S.M.T.?nSurface Mounting Technology n S.M.
2、Devicesn S.M.Assemblyn S.M.Machine 生产力促进组Created By:luckfang4电子元件知识电子元件知识n片式电阻-Chip Resistorn片式电容-Chip CapacitornSOT.:Small Outline TransistornSOD.:Small outline Dioden钽电容-Solid tantalum capacitors chips n圆柱体二级管-MELFn排阻-Chip Array Resistorn铝电容-Aluminium electrolytic SMD capacitors n电感-chips Inductor
3、s n电源TR-Power Transistor生产力促进组Created By:luckfang5电子元件知识电子元件知识n微调器nSOP.:Small Outline packagenQFP.:Quad Flat PackagenTQFP.:Thin Small Outline PackagenPLCC.:Plastic leaded Chip CarriernTSOP.:Thin Small Outline PackagenCSP.:Chip Scale PackagenBGA.:Ball Grid ArraynCONNECTOR生产力促进组Created By:luckfang6Chi
4、p outline description-元件尺寸nSize L*W(inch)Size L*W(mm)n0201 0.02*0.01 0503 0.5*0.25n0402 0.04*0.02 1005 1.0*0.5n0603 0.06*0.03 1608 1.5*0.76n0805 0.08*0.05 2012 2.0*1.25n1206 0.12*0.06 3216 3.2*1.6n1210 0.12*0.1 3225 3.2*2.5生产力促进组Created By:luckfang7SMD Components Shape-元件外形nChip 0603nSolid tantalum
5、capacitors chipsnAluminium electrolytic SMD capacitorsnSOT23nSOT143nSOT223nSO ICsnSOJ ICsnPLCC ICsnQFP ICsnBGA ICs生产力促进组Created By:luckfang8Humidity control level-湿度控制等级(LEVEL defined by IPC/JEDEC J-STD-020)nLevel Temp./Humidity Exposure time 1 =30 degree/85%Unlimited 2 =30 degree/60%1Year 2a=30 deg
6、ree/60%4Weeks 3 =30 degree/60%1Week 4 =30 degree/60%72Hrs.(3d.)5 =30 degree/60%48Hrs.5a=30 degree/60%24Hrs.6 Devices required baking before use,once baked,must be reflowed within 6 Hrs.生产力促进组Created By:luckfang9SMT process flowchart-工艺流程生产力促进组Created By:luckfang10SMT 常用术语nPCB-Print Circuit Board 印刷电
7、路板nESD-Electrostatic Sensitive Devices静电放电nPPM-Defects per Million 每百万的坏点nSPC-Statistic Process Control-过程统计分析nIron-电烙铁nHot Air Reflowing Noozle-热风嘴nTin Extractor-吸锡器nSoldering Wick-吸锡带nPost-Soldering Inspection-焊后检验nVisual Inspection-目视检验生产力促进组Created By:luckfang11SMT 常用术语nAOI-Automated Optical Ins
8、pection自动光学检查自动光学检查nAXI,Automated X-ray Inspection-自动自动X射线检查射线检查nSoldering Joint Quality-焊点质量焊点质量nSoldering Joint Defect-焊点缺陷焊点缺陷nSolder Wrong-错焊错焊nSolder Skips-漏焊漏焊nPseudo Soldering-虚焊虚焊nCold Soldering-冷焊冷焊nSolder Bridge-桥焊桥焊nOpen soldering-脱焊脱焊生产力促进组Created By:luckfang12SMT 常用术语nSolder-Off-焊点剥离nSo
9、lder Nonwetting-不湿润焊点nSoldering Balls-锡珠nIcicle/Solder Projection-拉尖nVoid-孔洞nSolder Wicking-焊料爬越nOverheated Solder Connection-过热焊点生产力促进组Created By:luckfang13SMT 常用术语nInsufficient Solder Connection-不饱和焊点nExcess Solder Connection-过量焊点nFlux Residue-助焊剂剩余nSolder Crazeing(Tearing)-焊料裂纹nFillet-Lifting,Lif
10、t-Off-焊角翘离nLoader-上板机nUnloader-下板机nDispenser-滴涂器,点胶机生产力促进组Created By:luckfang14SMT 常用术语nVacuum Pick&Place Tool-真空吸笔nPlace Machine,Pick&Place Machine,Chip Mounter,Chip Shooter-贴片机nWave Soldering Systems-波峰焊机nReflow Soldering Systems,Reflow Oven-再流焊炉nSelf-Alignment-自定位nSkewing-位移生产力促进组Created By:luckf
11、ang15SMT 常用术语nTomb Stone-立碑nFlying-掉片nICT,In Circuit Testing-在线测试nFT,Functional Testing-功能测试nRework Station-返工工作台nCleaning Systems-清洗机生产力促进组Created By:luckfang16焊锡基本知识助焊剂介质助焊剂介质(Flux medium)金属颗粒金属颗粒生产力促进组Created By:luckfang17 合金:合金是两种或两种以上的金属形成合金是两种或两种以上的金属形成的化合物的化合物,焊锡膏技术中所含的金焊锡膏技术中所含的金属成份通常为属成份通常为
12、:锡锡(Sn),铅铅(Pb),银银(Ag),铜铜(Cu)生产力促进组Created By:luckfang18软焊接n 无金属熔融结合无金属熔融结合n 金属键化合物金属键化合物(intermetallic layer)Cu3SnTin/lead 63/37 alloyCu3Sn and Cu6Sn5 IntermetallicFlux layer生产力促进组Created By:luckfang19普通的焊盘材料n铜及其合金铜及其合金n电镀铜电镀铜,黄铜黄铜,青铜青铜n有机镀膜焊盘有机镀膜焊盘(OSP)n镍及其合金镍及其合金n铁镍钴合金铁镍钴合金n银和金银和金生产力促进组Created By:
13、luckfang20CU CU 焊盘焊盘Gold over nickle pads阻焊膜阻焊膜典型多层典型多层FR4 PCBFR4 PCBSn or Ag pads生产力促进组Created By:luckfang21PCB raw material-PCB原材料MaterialBrand referencePCB technologyUtilizationThickness(mm)Phenolic paper laminateFR1,FR2*Standard(Single or double sided)TV chassisSimple modules1.6 0.14 1.5 0.141.2
14、 0.1Polyester glass laminateCEM3 T Standard(Single or double sided)Tuners1.2 0.11.0 0.1Epoxy paper/glass laminateCEM1StandardSingle or double sidedSPTHHigh end TV chassisModules1.6 0.14 1.5 0.14Epoxy glass laminateFR4DSPTHMultilayers(4 to 6)TunerHigh end modules&TV chassis,chassis for digital produc
15、tsChassis&modulesfor digital products1.0 10%1.5 10%1.6 10%1.6 10%生产力促进组Created By:luckfang22 基材 金属键化合物Cu Cu6Sn5 Ag Ag3SnAu AuSn4 Ni Ni3Sn4 焊接焊接:生产力促进组Created By:luckfang23生产力促进组Created By:luckfang24锡膏是将锡粉颗粒与介质锡膏是将锡粉颗粒与介质(Flux medium)充充分混合所形成的一种膏状物质分混合所形成的一种膏状物质,这种膏状物质具有可印这种膏状物质具有可印刷或点滴的能力刷或点滴的能力.什么是
16、锡膏什么是锡膏?生产力促进组Created By:luckfang25 锡膏主要成分n 锡粉颗粒金属(合金)n 助焊剂介质(Flux Medium)n 活性剂n 松香,树脂n 粘度调整剂n 溶剂生产力促进组Created By:luckfang26nPCBA常用锡膏合金 合金合金 代号代号 熔点熔点 备注备注Sn/PbSn63183*通 用 型Sn/Pb/AgSn62179*通 用 型 含 银 锡 膏Sn/Pb/Ag63S4179-183防 立 碑 特 色 锡 膏Sn/AgSn96221*无 铅,Lead FreeSn/Ag/Cu99C227*无 铅,Lead FreeSn/Ag/Cu96Sc
17、217*无 铅,Lead Free*最 低 共 熔 点(eutectic)生产力促进组Created By:luckfang27液相图液相图共熔点生产力促进组Created By:luckfang28助焊剂生产力促进组Created By:luckfang29 生产力促进组Created By:luckfang30介质类型合金类型颗粒尺寸金属含量CR32Sn62,Sn63,63S4AGS,Type389.5%96SC,96S,97SC (Pb-free)AGS,Type388%,88.5%CR37Sn62,Sn63AGS,Type390%,89.5%63S4 (Anti-tombstone)D
18、AD,Type489.5%MP100Sn62,Sn63AGS,Type389.5%,90%63S4 (Anti-tombstone)ACS,Type489.5%90%MP200Sn62,Sn63,63S4AGS,Type390%RP11Sn60,Sn62,Sn63AGS,Type389%,89.5%,90%RP15Sn60,Sn62,Sn63AGS,Type389%,90%63S4 (Anti-tombstone)ACS,Type489.5%生产力促进组Created By:luckfang31生产力促进组Created By:luckfang32助焊剂决定的焊锡膏特性生产力促进组Create
19、d By:luckfang33生产力促进组Created By:luckfang34生产力促进组Created By:luckfang35生产力促进组Created By:luckfang36生产力促进组Created By:luckfang37溶融的合金溶融的合金N2N2过大的尺寸过大的尺寸过小的尺寸过小的尺寸有用的锡粉有用的锡粉喷雾头喷雾头筛网筛网（涡轮丝网）（涡轮丝网）生产力促进组Created By:luckfang38溶解的合金溶解的合金N2N2过大的尺寸过大的尺寸过小的尺寸过小的尺寸有用的锡粉有用的锡粉筛网筛网（超声波型）（超声波型）超声波喷雾器超声波喷雾器生产力促进组Create
20、d By:luckfang39(AGS)0246810121405101520253035404550556065707580859095100Particle diameter(microns)Mass%45-20 microns=AGS生产力促进组Created By:luckfang40WidthLength球形长球形长/宽比宽比 1.5 1.5 MulticoreMulticore规格规格:球形颗粒球形颗粒=95%=95%minimumminimum生产力促进组Created By:luckfang41Distorted Spheres“Dog bones”or irregular生产
21、力促进组Created By:luckfang42stencilPCB baseSolder PowderIrregular Shape Powder生产力促进组Created By:luckfang43n优点n提高细间距焊盘的印刷性能提高细间距焊盘的印刷性能n提高耐坍塌性能提高耐坍塌性能n提高湿强度提高湿强度n增加润湿增加润湿/活化面积活化面积n局限n锡粉颗粒被氧化的几率增加锡粉颗粒被氧化的几率增加n锡珠缺陷的发生几率增加锡珠缺陷的发生几率增加生产力促进组Created By:luckfang44颗粒尺寸分布颗粒尺寸分布 最小印刷间距最小印刷间距 BAS(75-53m)0.625mm AAS
22、(53-38m)0.5mm 0.4mm AGS(45-20m)0.3mm ADS(45-10m)0.5mm CSP and BGA 颗粒的大小与印刷间距颗粒的大小与印刷间距生产力促进组Created By:luckfang45 颗粒的大小与印刷间距颗粒的大小与印刷间距Metal maskSolder Powder7553m/0.625mm3853m/0.40.5mm2045m/0.3mm1038m/0.3mm生产力促进组Created By:luckfang46n金属含量增高n锡珠溅出可能性降低锡珠溅出可能性降低n粘度增加粘度增加,印刷性能降低印刷性能降低方式方式 金属含量金属含量刮板印刷88
23、%-90%针筒式点膏83%-86%移针印83%-85%生产力促进组Created By:luckfang47锡膏测试生产力促进组Created By:luckfang48生产力促进组Created By:luckfang49DEK260 半自动印刷机半自动印刷机生产力促进组Created By:luckfang50生产力促进组Created By:luckfang51生产力促进组Created By:luckfang52生产力促进组Created By:luckfang53METAL SQUEEGEE SOLDER PASTE Fluidity is maintained by squeege
24、e during rolling Smooth rolling is an indication of good printability Solder paste is homogeneously mixed during rolling and printing in the same conditions.Rolling gives a homogeneous solder paste deposition on each pad,combined with the effect of debubbling.印刷时锡膏形成滚动印刷时锡膏形成滚动生产力促进组Created By:luckf
25、ang54刮刀刮刀聚氨脂聚氨脂,橡胶橡胶不锈钢不锈钢二者有什么不同二者有什么不同?生产力促进组Created By:luckfang55刮刀刮刀生产力促进组Created By:luckfang56不同的刮刀效果不同不同的刮刀效果不同生产力促进组Created By:luckfang57 材料n黄铜黄铜n不锈钢不锈钢n镍镍n塑料材料塑料材料 网孔n化学蚀刻化学蚀刻n激光切割激光切割n电镀电镀n缩小缩小10%网板生产力促进组Created By:luckfang58蚀刻后凹凸不平蚀刻后凹凸不平上下开口不一致上下开口不一致有唇的锥形开口有唇的锥形开口,表表面光滑面光滑锥形开口锥形开口网板开孔网板开
26、孔化学腐蚀法化学腐蚀法激光切割激光切割激光切割并电镀激光切割并电镀生产力促进组Created By:luckfang59激光切割并电镀激光切割并电镀化学蚀刻化学蚀刻激光切割激光切割不同网板的效果不同不同网板的效果不同生产力促进组Created By:luckfang60 环境生产力促进组Created By:luckfang61添加锡膏的方法生产力促进组Created By:luckfang62添加锡膏的方法生产力促进组Created By:luckfang63印刷参数控制生产力促进组Created By:luckfang64参数设置参数设置生产力促进组Created By:luckfang6
27、5使用注意事项生产力促进组Created By:luckfang66使用注意事项使用注意事项生产力促进组Created By:luckfang67使用注意事项使用注意事项生产力促进组Created By:luckfang68使用注意事项使用注意事项生产力促进组Created By:luckfang69回流焊工艺回流焊工艺生产力促进组Created By:luckfang70SEHO 6440 3.6 热风对流式回热风对流式回流炉流炉Machine located in MSM Ipoh Tech.Centre生产力促进组Created By:luckfang71贴片生产力促进组Created
28、By:luckfang72回流焊生产力促进组Created By:luckfang73回流焊生产力促进组Created By:luckfang74回流焊生产力促进组Created By:luckfang75回流焊生产力促进组Created By:luckfang76锡膏的回流焊生产力促进组Created By:luckfang77理想化的回流曲线050100150200250153045607590 105 120 135 150 165 180 195 210 225 240 255 270 285 300TIME(S)TEMP (0C)生产力促进组Created By:luckfang78
29、什么是理想的曲线？生产力促进组Created By:luckfang79为什么要使用回流曲线?生产力促进组Created By:luckfang80为什么要使用回流曲线?生产力促进组Created By:luckfang81操作窗口（举例）050100150200250300050100150200250300350Time/sTemperature/C生产力促进组Created By:luckfang82如何做回流曲线？生产力促进组Created By:luckfang83如何做回流曲线？生产力促进组Created By:luckfang84SoldaPro小器件区域大器件区域温度敏感型器件
30、用高温焊锡丝固定器件和热电偶生产力促进组Created By:luckfang85经过回流炉生产力促进组Created By:luckfang86050100150200250154575105135165195225255285Time(s)Temp(C)Board/SmallComponent LargeComponent下载数据至计算机生产力促进组Created By:luckfang87典型的回流曲线050100150200250154575105135165195225255285Time(s)Temp(C)Board/SmallComponent LargeComponent生产力
31、促进组Created By:luckfang88回流曲线手册生产力促进组Created By:luckfang89第一升温区05010015020025015 3045 60 75 90 105 120 135 150 165 180 195 210 225 240 255 270 285 300TIME(S)TEMP (0C)生产力促进组Created By:luckfang90第一升温区生产力促进组Created By:luckfang91预热区05010015020025015 3045 60 75 90 105 120 135 150 165 180 195 210 225 240 2
32、55 270 285 300TIME(S)TEMP (0C)生产力促进组Created By:luckfang92预热区生产力促进组Created By:luckfang93预热区生产力促进组Created By:luckfang94回流区05010015020025015 3045 60 75 90 105 120 135 150 165 180 195 210 225 240 255 270 285 300TIME(S)TEMP (0C)生产力促进组Created By:luckfang95回流区生产力促进组Created By:luckfang96冷却区（焊料凝固）05010015020
33、025015 3045 60 75 90 105 120 135 150 165 180 195 210 225 240 255 270 285 300TIME(S)TEMP (0C)生产力促进组Created By:luckfang97冷却区生产力促进组Created By:luckfang98焊膏回流时的状态生产力促进组Created By:luckfang99常见故障分析生产力促进组Created By:luckfang100印刷缺陷生产力促进组Created By:luckfang101助焊剂外溢生产力促进组Created By:luckfang102压力生产力促进组Created B
34、y:luckfang103压力过大Flux bleed“Scooping”生产力促进组Created By:luckfang104压力过小网板印刷不干净“Dog ears”生产力促进组Created By:luckfang105底部支撑不足生产力促进组Created By:luckfang106底部支撑不足网板留在网上的锡膏生产力促进组Created By:luckfang107刮刀损坏造成的问题生产力促进组Created By:luckfang108印刷间隙问题生产力促进组Created By:luckfang109阻焊膜层过厚Print gap 0印刷间隙生产力促进组Created By:
35、luckfang110常见印刷故障生产力促进组Created By:luckfang111常见印刷故障生产力促进组Created By:luckfang112常见印刷故障生产力促进组Created By:luckfang113常见印刷故障生产力促进组Created By:luckfang114温度&湿度生产力促进组Created By:luckfang115回流缺陷生产力促进组Created By:luckfang116常见的回流问题生产力促进组Created By:luckfang117溅锡锡珠生产力促进组Created By:luckfang118溅锡锡珠生产力促进组Created By:
36、luckfang119器件中间锡珠生产力促进组Created By:luckfang120生产力促进组Created By:luckfang121解决器件间锡珠的方案生产力促进组Created By:luckfang122n10-20%smaller than lands“Home plates”,etcbut half pitch for ICs etc生产力促进组Created By:luckfang123解决锡珠方案的设计生产力促进组Created By:luckfang124桥接生产力促进组Created By:luckfang125桥接生产力促进组Created By:luckfan
37、g126解决桥接的方案生产力促进组Created By:luckfang127断路生产力促进组Created By:luckfang128断路生产力促进组Created By:luckfang129立碑生产力促进组Created By:luckfang130不同尺寸器件立碑情况0805 0402 0201不易产生立碑十分容易产生立碑?生产力促进组Created By:luckfang131贴片的偏移会造成立碑生产力促进组Created By:luckfang132立碑的解决方案生产力促进组Created By:luckfang13363S4 ACS 防立碑合金生产力促进组Created By:luckfang13463S4 防立碑合金的机理生产力促进组Created By:luckfang135防立碑合金的缺点生产力促进组Created By:luckfang136
