1、WIRE BOND PROCESS INTRODUCTIONCONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT封裝簡介晶片晶片Die金線金線 Gold Wire導線架導線架Lead framWafer GrindingDie BondingWafer Sawtoaster Wire BondingDie Surface Coating Molding Laser Mark Solder Ball Placeme
2、nt SingulationPacking封裝流程 Dejunk TRIM Solder Plating Solder Plating Dejunk TRIM TRIM/FORMING BGASURFACEMOUNTPKGTHROUGHHOLE PKGWire Bond 原理GLASSSiO2SiGOLD BALL B.PRINCIPLE銲接條件 HARD WELDING Pressure(Force)Amplify&Frequecy Welding Time(Bond Time)Welding Tempature(Heater)THERMAL BONINGThermal Compressur
3、e Ultrasonic Energy(Power)Bond Head ASSY Low impact forceReal time Bonding Force monitoring High resolution z-axis position with 2.5 micron per step resolution Fast contact detection Suppressed Force vibration Fast Force response Fast response voice coil wire clampX Y TableLinear 3 phase AC Servo mo
4、torHigh power AC Current AmplifierDSP based control platformHigh X-Y positioning accuracy of+/-1 mmResolution of 0.2 mmW/H ASSY changeover Fully programmable indexer&tracks Motorized window clamp with soft close feature Output indexer with leadframe jam protection feature Tool less conversion window
5、 clamps and top plate enables fast deviceEagleBonding SystemBonding Method Thermosonic(TS)BQM Mode Constant Current,Voltage,Power and Normal (Programmable)Loop Type Normal,Low,Square&JXY Resolution 0.2 umZ Resolution(capillary travelling motion)2.5 umFine Pitch Capability 35 mm pitch 0.6 mil wireNo.
6、of Bonding Wires up to 1000Program Storage 1000 programs on Hard DiskMultimode Transducer System Programmable profile,control and vibration modesEagle Vision SystemPattern Recognition Time 70 ms/pointPattern Recognition Accuracy+0.37 umLead Locator Detection 12 ms/lead (3 leads/frame)Lead Locator Ac
7、curacy+2.4 umPost Bond Inspection First Bond,Second Bond Wire TracingMax.Die Level Different 400 500 umFacilitiesVoltage 110 VAC(optional 100/120/200/210/220/230/240 VACEagle Material Handling SystemIndexing Speed 200 250 ms 0.5“pitchIndexer Resolution 1umLeadframe Position Accuracy+2 milApplicable
8、Leadframe W=17 75 mm bonding area in Y=65mm =17 90 mm bonding area in Y=54mm L =280 mm Maximum T =0.075 0.8 mmApplicable Magazine W=100 mm(Maximum)L =140 300 mm H =180 mm(Maximum)Magazine Pitch 2.4 10 mm(0.09”0.39“)Device Changeover 4 minutesPackage Changeover 100 0,4 90/1004,8,11 9011,15IC type loo
9、p typeGold Wire Gold Wire Manufacturer (Nippon,SUMTOMO,TANAKA.)Gold Wire Data (Wire Diameter,Type,)SPEC Pad Open&Bond Pad Pitch Ball Size Ball Thickness Loop height Wire Pull Ball short Crater TestBPO&BPP 單位單位:um or Mil BPO:是指是指Pad內層內層X方向及方向及Y方向的方向的size,一般是取最小值為一般是取最小值為 我們的我們的data BPO:是指是指Pad如左邊內層至右
10、邊如左邊內層至右邊Pad左邊外層邊緣其它依左邊外層邊緣其它依此類推此類推;或著一個或著一個Die上出現不同上出現不同Pad大小那就是以兩個大小那就是以兩個Pad中中心距離為心距離為BPP,但是一般我們要取一個但是一般我們要取一個Die上最小的上最小的BPPBond Pad PitchBond Pad OpenBond Pad OpenBall SizeBall ThicknessBall Size&Ball Thickness 單位單位:um，Mil 量測倍率量測倍率:50X Ball Thickness 計算公式 60 um BPP 1/2 WD=50%60 um BPP 1/2 WD=40
11、%50%Ball SizeLoop Heigh 單位單位:um，Mil 量測倍率量測倍率:20XLoop Height 線長線長Wire Pull 1 Lifted Bond(Rejected)2 Break at neck(Refer wire-pull spec)3 Break at wire(Refer wire-pull spec)4 Break at stitch(Refer stitch-pull spec)5 Lifted weld(Rejected)Ball Short 單位單位:gram or g/milg/mil Ball Shear Ball Shear 計算公式計算公式
12、 IntermetallicIntermetallic（IMCIMC）有有75%75%的共晶的共晶,SHEAR STRENGTH SHEAR STRENGTH 標準為標準為6.06.0g/milg/mil。SHEAR STRENGTHBall Shear/Area (g/milBall Shear/Area (g/mil)Ball Shear=x;Ball Size=y;Area=(y/2)Ball Shear=x;Ball Size=y;Area=(y/2)x/(y/2)x/(y/2)=z g/mil=z g/milCBall bondTest specimenSpecimen clampS
13、hearing ramWireBond shoulderInterfacial contactball bond weld areaBonding padh(A)UnshearedCLCBall bondCLTest specimenSpecimen clampBonding padFull ball attached towire-except for regionsof intermetallic voidingBall separated at bonding pad-Ball interface-residual intermetallic(and sometimes portion
14、of unalloyedball and metal)on pad in bondinteraction area(D)Ball bond-bonding pad interface separation(typical Au to Al)CTest specimenSpecimen clampShearing ramWireMinor fragment of ballattached to wireBonding padCLBall sheared too high(off line,etc.)only aportion of shoulder andball top removedInte
15、rfacial contactball bond weld area(B)Wire(ball top and/or side)shearCBall bondCLTest specimenSpecimen clampShearing ramBonding padMajor portionof ball attached to wireInterfacial contact-ball bond weld areaintact(C)Below center line shear,ball sheared through(typically Au to Au)CBall bondCLTest spec
16、imenSpecimen clampBonding padPad metallizationseparates fromunderlying surfaceResidual pad on ballball-pad interfaceremains intact(E)Bond pad liftsTest specimenSpecimen clampCBall bondCLBonding padBonding pad lifts,taking portion of underlyingsubstrate material with it(F)CrateringResidual pad and su
17、bstrate attachedto ball,ball-pad interface remainsintactShear Failure ModesCrater TestCalculate(I)UP Time=(Total Actual Production Times Total Repair Time)Total Actual Production TimeDOWN TIME RATE=Total Repair TimeTotal Actual Production TimesTotal Operator Actual Repair TimeTotal Operator Repair F
18、requency StoppagesTotal Actual Production Times Total Operator Repair Time Total Operator Repair Frequency StoppagesTotal Technical Actual Repair TimesTotal Technical Repair Frequency StoppagesMTTS(MEAN TIME TO STOP)=MTBS(MEAN TIME BETWEEN STOP)=MTTA(MEAN TIME TO ASSISTANCE)=Calculate(II)MTBA(Mean T
19、ime Between Assistance)=Total Actual Production Times Total Technican Repair Times Total Technical Repair Frequency StoppagesMTBF(Mean Time Between Failure)=Total Actual Production Times Total Technician Repair TimeTotal Change Parts Repair Frequency Stoppage規格寬度規格寬度 製程寬度製程寬度 規格上限規格上限-規格下限規格下限 6(公差公
20、差)(上限上限 or 下限下限)-平均值平均值 三個公差三個公差 CP(製程能力指標製程能力指標)=CPK=Quality 正常品正常品 Material Problem 1st Bond issue (Peeling,Ball Lift,Off Center)2nd Bond issue (滑針，縫點脫，滑針，縫點脫，short tail )Looping Fail (wire snake wire，sweep wire loop base bent)正常品Material ProblemWith BallWirePad SizeMissing BallWire BrokenBonding
21、Ball Inspection Ball Detection Ball Size Pad CenterBall CenterBall Placement(X,Y)Ball Off Pad Bonding Ball Inspection(cont.)Ball Measurement Peeling1st Bond Fail(I)Ball Lift1st Bond Fail(II)Ball Lift Neck Crack1st Bond Fail(III)Off Center1st Bond Fail(IV)Off Center Ball1st Bond Fail(V)Smash BallSmas
22、h BallWith WeldWireCapillary MarkMissing WeldWire BrokenLeadBonding Weld Inspection Weld Detection 2nd Bond Fail(I)滑針滑針 2nd Bond Fail(II)縫點脫落縫點脫落縫點脫落縫點脫落 Looping Fail(Wire Short I)Wire SweepWire ShortLooping Fail(Wire Short II)Loop Base BendWire ShortLooping Fail(Wire Short III)Excessive Loop Wire ShortTHE END谢谢观看！2020
