1、Sept/20/20031UP the Testing Profile SkillIslandtek International Ltd.SkillUP the Testing Profile SkillPrepare and Present by Danny.LuSept/20/20032UP the Testing Profile SkillIslandtek International Ltd.Skill 測量Profile的用意為何?如何進行Profile量測?怎樣才算是符合製程需要的Profile曲線?如何快速尋求符合需要的Profile曲線?如何利用Reflow改善製程的品質良率?
2、Sept/20/20033UP the Testing Profile SkillIslandtek International Ltd.Skill測量Profile的用意各種不同製程Profile的介紹量測Profile的時機Sept/20/20034UP the Testing Profile SkillIslandtek International Ltd.SkillFrom IPCSept/20/20035UP the Testing Profile SkillIslandtek International Ltd.SkillFrom IPCSept/20/20036UP the Te
3、sting Profile SkillIslandtek International Ltd.SkillFrom IPCSept/20/20037UP the Testing Profile SkillIslandtek International Ltd.Skill1.Slump 2.均溫性 3.生產效能4.板子大小Sept/20/20038UP the Testing Profile SkillIslandtek International Ltd.SkillSept/20/20039UP the Testing Profile SkillIslandtek International L
4、td.Skill 如何進行Profile量測 測量Profile的種類 紅外線,便當盒,釣魚線,溫度模擬 測溫線的種類 測溫線的測溫原理 測溫板的製作:PCBA公板選擇 測溫點的選擇 測溫線及埋點的製作Sept/20/200310UP the Testing Profile SkillIslandtek International Ltd.Skill測溫線種類Type K Ni-Cr合金 vs.Ni-Al合金 -200 1250 1.5 Type T Cu vs.Cu-Ni合金 -200 400 0.5 Type J Fe vs.Cu-Ni合金 -210 800 1.5 Type N Ni-1
5、4.2%Cr-1.4%Si vs.Ni-14.4%Si-0.1%Mg -200 1280 1.5 Sept/20/200311UP the Testing Profile SkillIslandtek International Ltd.SkillFind chip components(0603 preferred)in the corner of boards for Board/passive temperature dataPassive componentBGA(27mm)cornerCenterCentercornerAN30A16O8SocketFrom IntelSept/20
6、/200313UP the Testing Profile SkillIslandtek International Ltd.Skill1-C1B1(0603)2-SKT corner3-SKT inner4-SKT lever6-MCH in7-U4A18-U5G15-MCH out9-U1F2(SSOP24)佈點範例From IntelSept/20/200314UP the Testing Profile SkillIslandtek International Ltd.SkillFrom IPCSept/20/200315UP the Testing Profile SkillIsla
7、ndtek International Ltd.SkillSept/20/200316UP the Testing Profile SkillIslandtek International Ltd.SkillFrom IntelSept/20/200317UP the Testing Profile SkillIslandtek International Ltd.Skill怎樣才算是符合製程需要的Profile曲線?依照產品別,錫膏的不同,PCB的種類不同,及零件不同等因素進行Sept/20/200318UP the Testing Profile SkillIslandtek Intern
8、ational Ltd.SkillKESTERALPHAIndiumSept/20/200319UP the Testing Profile SkillIslandtek International Ltd.SkillSMICKOKITHERESASept/20/200320UP the Testing Profile SkillIslandtek International Ltd.Skill如何快速尋求符合需要的Profile曲線?Profile調整小技巧分享1.溫度區間間隔法2.投影片比對法Sept/20/200321UP the Testing Profile SkillIslandt
9、ek International Ltd.Skill123456789溫度變化轉折點Sept/20/200322UP the Testing Profile SkillIslandtek International Ltd.SkillA:ramp up rate during preheat:1.53.0 oC/secB C:soaking temperature:145175 oCD:ramp up rate during reflow:1.22.3 oC/secE:ramp down rate during cooling:1.72.2 oC/secFG:peak temperature:
10、230250 oCT1:preheat time:5080 secT2:dwell time during soaking:6090 secT3:time above 220 oC:2040 sec5010010015020025050Sec.D oC/sec150200pre-heatsoakingcoolingreflowA oC/secB oCFG oCT2T3E oC/secT1C oC220250Sept/20/200323UP the Testing Profile SkillIslandtek International Ltd.Skill Reflow溫度與製程間相互關係 各區
11、段代表意義 SMT不良情形與Profile之相互關係 如何藉由調整Profile改善製程良率 問題討論Sept/20/200324UP the Testing Profile SkillIslandtek International Ltd.SkillSept/20/200325UP the Testing Profile SkillIslandtek International Ltd.Skill、Sept/20/200326UP the Testing Profile SkillIslandtek International Ltd.Skill Sept/20/200327UP the T
12、esting Profile SkillIslandtek International Ltd.Skill Sept/20/200328UP the Testing Profile SkillIslandtek International Ltd.SkillSept/20/200329UP the Testing Profile SkillIslandtek International Ltd.SkillSept/20/200330UP the Testing Profile SkillIslandtek International Ltd.Skill 190 200 210 220 230
13、240 250 260BGA(210230)SOP(210240)QFP(200240)CHIP(205245)LED(190225)SAFE PEAKTEMP,RANGESETTINGBY M.E.S190 200 210 220 230 240 250 260Sept/20/200331UP the Testing Profile SkillIslandtek International Ltd.Skill對於無法耐熱製程之解決對策理想狀況曲線Sept/20/200332UP the Testing Profile SkillIslandtek International Ltd.SkillSept/20/200333UP the Testing Profile SkillIslandtek International Ltd.Skill
